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AT17F080-30BJJ

Description
Configuration Memory, 8MX1, Serial, CMOS, PQCC44, PLASTIC, MS-018AC, LCC-44
Categorystorage    storage   
File Size233KB,20 Pages
ManufacturerAtmel (Microchip)
Environmental Compliance
Download Datasheet Parametric Compare View All

AT17F080-30BJJ Overview

Configuration Memory, 8MX1, Serial, CMOS, PQCC44, PLASTIC, MS-018AC, LCC-44

AT17F080-30BJJ Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerAtmel (Microchip)
Parts packaging codeLPCC
package instructionQCCJ,
Contacts44
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum clock frequency (fCLK)33 MHz
JESD-30 codeS-PQCC-J44
JESD-609 codee3
length16.586 mm
memory density8388608 bit
Memory IC TypeCONFIGURATION MEMORY
memory width1
Humidity sensitivity level2
Number of functions1
Number of terminals44
word count8388608 words
character code8000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8MX1
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Package shapeSQUARE
Package formCHIP CARRIER
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)245
Certification statusNot Qualified
Maximum seat height4.572 mm
Maximum supply voltage (Vsup)3.63 V
Minimum supply voltage (Vsup)2.97 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperature40
width16.586 mm
Maximum write cycle time (tWC)0.03 ms
Features
Programmable 4,194,304 x 1 and 8,388,608 x 1-bit Serial Memories Designed to Store
Configuration Programs for Field Programmable Gate Arrays (FPGAs)
3.3V Output Capability
5V Tolerant I/O Pins
Program Support using the Atmel ATDH2200E System or Industry Third Party
Programmers
In-System Programmable (ISP) via 2-wire Bus
Simple Interface to SRAM FPGAs
Compatible with Atmel AT40K and AT94K Devices, Altera
®
FLEX
®
, APEX
Devices,
Lucent
®
ORCA
®
FPGAs, Xilinx
®
XC3000, XC4000, XC5200, Spartan
®
, Virtex
FPGAs,
Motorola
®
MPA1000 FPGAs
Cascadable Read-back to Support Additional Configurations or Higher-density Arrays
Low-power CMOS FLASH Process
Available in 6 mm x 6 mm x 1 mm 8-lead LAP (Pin-compatible with 8-lead SOIC/VOIC
Packages), 20-lead PLCC, 44-lead PLCC and 44-lead TQFP Packages
Emulation of Atmel’s AT24CXXX Serial EEPROMs
Low-power Standby Mode
Single Device Capable of Holding 4 Bit Stream Files Allowing Simple System
Reconfiguration
Fast Serial Download Speeds up to 33 MHz
Endurance: 5,000 Write Cycles Typical
Green (Pb/Halide-free/RoHS Compliant) Package Options Available
FPGA
Configuration
Flash Memory
AT17F040
AT17F080
1. Description
The AT17F Series of In-System Programmable Configuration PROMs (Configurators)
provide an easy-to-use, cost-effective configuration memory for Field Programmable
Gate Arrays. The AT17F Series device is packaged in the 8-lead LAP, 20-lead PLCC,
44-lead PLCC and 44-lead TQFP, see
Table 1-1.
The AT17F Series Configurator
uses a simple serial-access procedure to configure one or more FPGA devices.
The AT17F Series Configurators can be programmed with industry-standard program-
mers, Atmel’s ATDH2200E Programming Kit or Atmel’s ATDH2225 ISP Cable.
Table 1-1.
Package
8-lead LAP
20-lead PLCC
44-lead PLCC
44-lead TQFP
AT17F Series Packages
AT17F040
Yes
Yes
AT17F080
Yes
Yes
Yes
Yes
3039J–CNFG–04/06

AT17F080-30BJJ Related Products

AT17F080-30BJJ AT17F080-30JL AT17F040-30CL AT17F040-30JL AT17F080-30BJL AT17F080-30CL
Description Configuration Memory, 8MX1, Serial, CMOS, PQCC44, PLASTIC, MS-018AC, LCC-44 Configuration Memory, 8MX1, Serial, CMOS, PQCC20, PLASTIC, MS-018AA, LCC-20 Configuration Memory, 4MX1, Serial, CMOS, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8 Configuration Memory, 4MX1, Serial, CMOS, PQCC20, PLASTIC, MS-018AA, LCC-20 Configuration Memory, 8MX1, Serial, CMOS, PQCC44, PLASTIC, MS-018AC, LCC-44 Configuration Memory, 8MX1, Serial, CMOS, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Parts packaging code LPCC LPCC SOIC LPCC LPCC SOIC
package instruction QCCJ, QCCJ, SON, QCCJ, QCCJ, SON,
Contacts 44 20 8 20 44 8
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 33 MHz 33 MHz 33 MHz 33 MHz 33 MHz 33 MHz
JESD-30 code S-PQCC-J44 S-PQCC-J20 S-XDSO-N8 S-PQCC-J20 S-PQCC-J44 S-XDSO-N8
length 16.586 mm 8.9662 mm 5.99 mm 8.9662 mm 16.586 mm 5.99 mm
memory density 8388608 bit 8388608 bit 4194304 bit 4194304 bit 8388608 bit 8388608 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY
memory width 1 1 1 1 1 1
Humidity sensitivity level 2 2 3 2 2 3
Number of functions 1 1 1 1 1 1
Number of terminals 44 20 8 20 44 8
word count 8388608 words 8388608 words 4194304 words 4194304 words 8388608 words 8388608 words
character code 8000000 8000000 4000000 4000000 8000000 8000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 8MX1 8MX1 4MX1 4MX1 8MX1 8MX1
Package body material PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED
encapsulated code QCCJ QCCJ SON QCCJ QCCJ SON
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form CHIP CARRIER CHIP CARRIER SMALL OUTLINE CHIP CARRIER CHIP CARRIER SMALL OUTLINE
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) 245 245 260 245 245 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.572 mm 4.572 mm 1.14 mm 4.572 mm 4.572 mm 1.14 mm
Maximum supply voltage (Vsup) 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V
Minimum supply voltage (Vsup) 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface MATTE TIN MATTE TIN COPPER NICKEL GOLD MATTE TIN MATTE TIN COPPER NICKEL GOLD
Terminal form J BEND J BEND NO LEAD J BEND J BEND NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD QUAD DUAL QUAD QUAD DUAL
Maximum time at peak reflow temperature 40 40 40 40 40 40
width 16.586 mm 8.9662 mm 5.99 mm 8.9662 mm 16.586 mm 5.99 mm
Maximum write cycle time (tWC) 0.03 ms 0.03 ms 0.03 ms 0.03 ms 0.03 ms 0.03 ms
Maker Atmel (Microchip) - Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip)
JESD-609 code e3 e3 - e3 e3 -

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