LM358MWA datasheet, PDF - EEWORLD Datasheet

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LM358MWA: DescriptionIC DUAL OP-AMP, 9000 uV OFFSET-MAX, 1 MHz BAND WIDTH, UUC, WAFER, Operational Amplifier; CategoryAnalog mixed-signal IC Amplifier circuit; File Size518KB，24 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com; Environmental Compliance

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LM358MWA Overview

IC DUAL OP-AMP, 9000 uV OFFSET-MAX, 1 MHz BAND WIDTH, UUC, WAFER, Operational Amplifier

LM358MWA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	National Semiconductor（TI ）
Parts packaging code	WAFER
package instruction	, WAFER
Reach Compliance Code	compliant
ECCN code	EAR99
Amplifier type	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK
Maximum average bias current (IIB)	0.5 µA
Maximum bias current (IIB) at 25C	0.25 µA
Nominal Common Mode Rejection Ratio	85 dB
frequency compensation	YES
Maximum input offset voltage	9000 µV
JESD-30 code	X-XUUC-N
low-dissonance	NO
Humidity sensitivity level	1
Negative supply voltage upper limit
Nominal Negative Supply Voltage (Vsup)
Number of functions	2
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	UNSPECIFIED
Encapsulate equivalent code	WAFER
Package shape	UNSPECIFIED
Package form	UNCASED CHIP
Peak Reflow Temperature (Celsius)	260
power supply	+-1.5/+-15/3/30 V
Certification status	Not Qualified
Nominal slew rate	0.1 V/us
Maximum slew rate	2 mA
Supply voltage upper limit	32 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal location	UPPER
Maximum time at peak reflow temperature	40
Nominal Uniform Gain Bandwidth	1000 kHz
Minimum voltage gain	15000

LM358MWA Related Products

	LM358MWA	LM158AMD8	LM158MD8	LM2904MWA	LM2904MWC	LM358MDA	LM158AH-MLS
Description	IC DUAL OP-AMP, 9000 uV OFFSET-MAX, 1 MHz BAND WIDTH, UUC, WAFER, Operational Amplifier	IC,OP-AMP,DUAL,BIPOLAR,DIE	IC DUAL OP-AMP, 7000 uV OFFSET-MAX, 1 MHz BAND WIDTH, UUC, DIE, Operational Amplifier	IC,OP-AMP,DUAL,BIPOLAR,WAFER	IC DUAL OP-AMP, 10000 uV OFFSET-MAX, 1 MHz BAND WIDTH, UUC, WAFER, Operational Amplifier	IC DUAL OP-AMP, 9000 uV OFFSET-MAX, 1 MHz BAND WIDTH, UUC, DIE, Operational Amplifier	IC DUAL OP-AMP, 4000 uV OFFSET-MAX, 1 MHz BAND WIDTH, MBCY8, METAL CAN, TO-5, 8 PIN, Operational Amplifier
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	incompatible
package instruction	, WAFER	, DIE OR CHIP	DIE, DIE OR CHIP	, WAFER	DIE, WAFER	DIE, DIE OR CHIP	TO-5, CAN8,.2
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	unknown
Amplifier type	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK
Maximum bias current (IIB) at 25C	0.25 µA	0.05 µA	0.05 µA	0.25 µA	0.25 µA	0.25 µA	0.05 µA
frequency compensation	YES	YES	YES	YES	YES	YES	YES
Maximum input offset voltage	9000 µV	4000 µV	7000 µV	10000 µV	10000 µV	9000 µV	4000 µV
low-dissonance	NO	NO	NO	NO	NO	NO	NO
Number of functions	2	2	2	2	2	2	2
Maximum operating temperature	70 °C	125 °C	125 °C	85 °C	85 °C	70 °C	125 °C
Minimum operating temperature	-	-55 °C	-55 °C	-40 °C	-40 °C	-	-55 °C
Encapsulate equivalent code	WAFER	DIE OR CHIP	DIE OR CHIP	WAFER	WAFER	DIE OR CHIP	CAN8,.2
power supply	+-1.5/+-15/3/30 V	+-1.5/+-15/3/30 V	+-1.5/+-15/3/30 V	+-1.5/+-13/3/26 V	+-1.5/+-13/3/26 V	+-1.5/+-15/3/30 V	+-1.5/+-15/3/30 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	2 mA	2 mA	2 mA	2 mA	2 mA	2 mA	2 mA
Supply voltage upper limit	32 V	16 V	32 V	13 V	26 V	32 V	32 V
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	MILITARY
Minimum voltage gain	15000	25000	25000	15000	15000	15000	25000
Maker	National Semiconductor（TI ）	-	-	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）
Parts packaging code	WAFER	-	WAFER	-	WAFER	WAFER	BCY
ECCN code	EAR99	-	EAR99	-	EAR99	EAR99	EAR99
Maximum average bias current (IIB)	0.5 µA	-	0.3 µA	-	0.5 µA	0.5 µA	0.1 µA
Nominal Common Mode Rejection Ratio	85 dB	-	85 dB	-	70 dB	85 dB	85 dB
JESD-30 code	X-XUUC-N	-	X-XUUC-N	-	X-XUUC-N	X-XUUC-N	O-MBCY-W8
Humidity sensitivity level	1	1	1	1	1	1	-
Package body material	UNSPECIFIED	-	UNSPECIFIED	-	UNSPECIFIED	UNSPECIFIED	METAL
Package shape	UNSPECIFIED	-	UNSPECIFIED	-	UNSPECIFIED	UNSPECIFIED	ROUND
Package form	UNCASED CHIP	-	UNCASED CHIP	-	UNCASED CHIP	UNCASED CHIP	CYLINDRICAL
Peak Reflow Temperature (Celsius)	260	-	260	-	260	260	NOT SPECIFIED
Nominal slew rate	0.1 V/us	-	0.5 V/us	-	0.1 V/us	0.1 V/us	0.5 V/us
Nominal supply voltage (Vsup)	5 V	-	5 V	-	5 V	5 V	5 V
surface mount	YES	-	YES	-	YES	YES	NO
Terminal form	NO LEAD	-	NO LEAD	-	NO LEAD	NO LEAD	WIRE
Terminal location	UPPER	-	UPPER	-	UPPER	UPPER	BOTTOM
Maximum time at peak reflow temperature	40	-	40	-	40	40	NOT SPECIFIED
Nominal Uniform Gain Bandwidth	1000 kHz	1000 kHz	1000 kHz	-	1000 kHz	1000 kHz	1000 kHz
encapsulated code	-	-	DIE	-	DIE	DIE	TO-5

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