SMC6281F6 datasheet, PDF - EEWORLD Datasheet

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SMC6281F6: DescriptionIC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，53 Pages; ManufacturerSeiko Epson Corporation

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SMC6281F6 Overview

IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC

SMC6281F6 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Seiko Epson Corporation
Parts packaging code	QFP
package instruction	LQFP, QFP64,.66SQ,32
Contacts	64
Reach Compliance Code	compliant
Has ADC	NO
Address bus width	8
bit size	4
CPU series	E0C6200/SMC6200
DAC channel	NO
DMA channel	NO
External data bus width	4
JESD-30 code	S-PQFP-G64
JESD-609 code	e0
Negative supply voltage rating	-3 V
Number of I/O lines	4
Number of terminals	64
Maximum operating temperature	70 °C
Minimum operating temperature	-20 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Encapsulate equivalent code	QFP64,.66SQ,32
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE
power supply	-3 V
Certification status	Not Qualified
RAM (bytes)	48
rom(word)	1024
ROM programmability	MROM
Maximum slew rate	0.01 mA
Maximum supply voltage	3.5 V
Minimum supply voltage	1.8 V
Nominal supply voltage	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULLWING
Terminal pitch	0.8 mm
Terminal location	QUAD

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SMC6281F6 Related Products

	SMC6281F6	SMC62L81F6	SMC62L81F13	SMC62A81F6	SMC62A81F13	SMC62B81F13	SMC62B81F6	SMC6281F13
Description	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC
Parts packaging code	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP
package instruction	LQFP, QFP64,.66SQ,32	LQFP, QFP64,.66SQ,32	LFQFP, QFP64,.47SQ,20	QFP, QFP64,.66SQ,32	QFP, QFP64,.47SQ,20	QFP, QFP64,.47SQ,20	QFP, QFP64,.66SQ,32	LFQFP, QFP64,.47SQ,20
Contacts	64	64	64	64	64	64	64	64
Reach Compliance Code	compliant	compliant	unknown	unknown	compliant	compliant	compliant	compliant
bit size	4	4	4	4	4	4	4	4
CPU series	E0C6200/SMC6200	E0C6200/SMC6200	E0C6200/SMC6200	E0C6200/SMC6200	E0C6200/SMC6200	E0C6200/SMC6200	E0C6200/SMC6200	E0C6200/SMC6200
JESD-30 code	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
Negative supply voltage rating	-3 V	-1.5 V	-1.5 V	-3 V	-3 V	-1.5 V	-1.5 V	-3 V
Number of terminals	64	64	64	64	64	64	64	64
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Minimum operating temperature	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	LQFP	LFQFP	QFP	QFP	QFP	QFP	LFQFP
Encapsulate equivalent code	QFP64,.66SQ,32	QFP64,.66SQ,32	QFP64,.47SQ,20	QFP64,.66SQ,32	QFP64,.47SQ,20	QFP64,.47SQ,20	QFP64,.66SQ,32	QFP64,.47SQ,20
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK, LOW PROFILE, FINE PITCH
power supply	-3 V	-1.5 V	-1.5 V	-3 V	-3 V	-1.5 V	-1.5 V	-3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	48	48	48	48	48	48	48	48
rom(word)	1024	1024	1024	1024	1024	1024	1024	1024
ROM programmability	MROM	MROM	MROM	MROM	MROM	MROM	MROM	MROM
Maximum slew rate	0.01 mA	0.01 mA	0.01 mA	0.025 mA	0.025 mA	0.025 mA	0.025 mA	0.01 mA
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULLWING	GULLWING	GULLWING	GULL WING	GULL WING	GULL WING	GULL WING	GULLWING
Terminal pitch	0.8 mm	0.8 mm	0.5 mm	0.8 mm	0.5 mm	0.5 mm	0.8 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Is it Rohs certified?	incompatible	incompatible	-	-	incompatible	incompatible	incompatible	incompatible
Base Number Matches	-	1	1	1	1	1	1	-

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