IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Seiko Epson Corporation |
| Parts packaging code | QFP |
| package instruction | LFQFP, QFP64,.47SQ,20 |
| Contacts | 64 |
| Reach Compliance Code | compliant |
| Has ADC | NO |
| Address bus width | 8 |
| bit size | 4 |
| CPU series | E0C6200/SMC6200 |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | 4 |
| JESD-30 code | S-PQFP-G64 |
| JESD-609 code | e0 |
| Negative supply voltage rating | -3 V |
| Number of I/O lines | 4 |
| Number of terminals | 64 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -20 °C |
| PWM channel | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LFQFP |
| Encapsulate equivalent code | QFP64,.47SQ,20 |
| Package shape | SQUARE |
| Package form | FLATPACK, LOW PROFILE, FINE PITCH |
| power supply | -3 V |
| Certification status | Not Qualified |
| RAM (bytes) | 48 |
| rom(word) | 1024 |
| ROM programmability | MROM |
| Maximum slew rate | 0.01 mA |
| Maximum supply voltage | 3.5 V |
| Minimum supply voltage | 1.8 V |
| Nominal supply voltage | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULLWING |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| SMC6281F13 | SMC62L81F6 | SMC62L81F13 | SMC62A81F6 | SMC62A81F13 | SMC62B81F13 | SMC62B81F6 | SMC6281F6 | |
|---|---|---|---|---|---|---|---|---|
| Description | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC |
| Parts packaging code | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
| package instruction | LFQFP, QFP64,.47SQ,20 | LQFP, QFP64,.66SQ,32 | LFQFP, QFP64,.47SQ,20 | QFP, QFP64,.66SQ,32 | QFP, QFP64,.47SQ,20 | QFP, QFP64,.47SQ,20 | QFP, QFP64,.66SQ,32 | LQFP, QFP64,.66SQ,32 |
| Contacts | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| Reach Compliance Code | compliant | compliant | unknown | unknown | compliant | compliant | compliant | compliant |
| bit size | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| CPU series | E0C6200/SMC6200 | E0C6200/SMC6200 | E0C6200/SMC6200 | E0C6200/SMC6200 | E0C6200/SMC6200 | E0C6200/SMC6200 | E0C6200/SMC6200 | E0C6200/SMC6200 |
| JESD-30 code | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Negative supply voltage rating | -3 V | -1.5 V | -1.5 V | -3 V | -3 V | -1.5 V | -1.5 V | -3 V |
| Number of terminals | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Minimum operating temperature | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LFQFP | LQFP | LFQFP | QFP | QFP | QFP | QFP | LQFP |
| Encapsulate equivalent code | QFP64,.47SQ,20 | QFP64,.66SQ,32 | QFP64,.47SQ,20 | QFP64,.66SQ,32 | QFP64,.47SQ,20 | QFP64,.47SQ,20 | QFP64,.66SQ,32 | QFP64,.66SQ,32 |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK, LOW PROFILE |
| power supply | -3 V | -1.5 V | -1.5 V | -3 V | -3 V | -1.5 V | -1.5 V | -3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 48 | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
| rom(word) | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
| ROM programmability | MROM | MROM | MROM | MROM | MROM | MROM | MROM | MROM |
| Maximum slew rate | 0.01 mA | 0.01 mA | 0.01 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.01 mA |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULLWING | GULLWING | GULLWING | GULL WING | GULL WING | GULL WING | GULL WING | GULLWING |
| Terminal pitch | 0.5 mm | 0.8 mm | 0.5 mm | 0.8 mm | 0.5 mm | 0.5 mm | 0.8 mm | 0.8 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| Is it Rohs certified? | incompatible | incompatible | - | - | incompatible | incompatible | incompatible | incompatible |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | - |