AM27H256-70/BXA datasheet, PDF

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AM27H256-70/BXA: DescriptionUVPROM, 32KX8, 70ns, CMOS, CDIP28, CERAMIC, DIP-28; Categorystorage storage; File Size333KB，11 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM27H256-70/BXA Overview

UVPROM, 32KX8, 70ns, CMOS, CDIP28, CERAMIC, DIP-28

AM27H256-70/BXA Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	AMD
Parts packaging code	DIP
package instruction	WDIP, DIP28,.6
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	70 ns
I/O type	COMMON
JESD-30 code	R-GDIP-T28
JESD-609 code	e0
length	37.1475 mm
memory density	262144 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	32KX8
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	WDIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE, WINDOW
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Programming voltage	12.75 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum seat height	5.588 mm
Maximum standby current	0.035 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

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AM27H256-70/BXA Related Products

	AM27H256-70/BXA	AM27H256-55/BXA	AM27H256-70/BUA	AM27H256-55/BUA
Description	UVPROM, 32KX8, 70ns, CMOS, CDIP28, CERAMIC, DIP-28	UVPROM, 32KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28	UVPROM, 32KX8, 70ns, CMOS, CQCC32, CERAMIC, LCC-32	UVPROM, 32KX8, 55ns, CMOS, CQCC32, CERAMIC, LCC-32
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	AMD	AMD	AMD	AMD
Parts packaging code	DIP	DIP	QFJ	QFJ
package instruction	WDIP, DIP28,.6	WDIP, DIP28,.6	WQCCN, LCC32,.45X.55	WQCCN, LCC32,.45X.55
Contacts	28	28	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	70 ns	55 ns	70 ns	55 ns
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-GDIP-T28	R-GDIP-T28	R-CQCC-N32	R-CQCC-N32
JESD-609 code	e0	e0	e0	e0
length	37.1475 mm	37.1475 mm	13.97 mm	13.97 mm
memory density	262144 bit	262144 bit	262144 bit	262144 bit
Memory IC Type	UVPROM	UVPROM	UVPROM	UVPROM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	28	28	32	32
word count	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
organize	32KX8	32KX8	32KX8	32KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WDIP	WDIP	WQCCN	WQCCN
Encapsulate equivalent code	DIP28,.6	DIP28,.6	LCC32,.45X.55	LCC32,.45X.55
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE, WINDOW	IN-LINE, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V
Programming voltage	12.75 V	12.75 V	12.75 V	12.75 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Maximum seat height	5.588 mm	5.588 mm	3.556 mm	3.556 mm
Maximum standby current	0.035 A	0.035 A	0.035 A	0.035 A
Maximum slew rate	0.06 mA	0.06 mA	0.06 mA	0.06 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	15.24 mm	11.43 mm	11.43 mm

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