UVPROM, 32KX8, 55ns, CMOS, CQCC32, CERAMIC, LCC-32
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Parts packaging code | QFJ |
| package instruction | WQCCN, LCC32,.45X.55 |
| Contacts | 32 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 55 ns |
| I/O type | COMMON |
| JESD-30 code | R-CQCC-N32 |
| JESD-609 code | e0 |
| length | 13.97 mm |
| memory density | 262144 bit |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 32KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | WQCCN |
| Encapsulate equivalent code | LCC32,.45X.55 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER, WINDOW |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Programming voltage | 12.75 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum seat height | 3.556 mm |
| Maximum standby current | 0.035 A |
| Maximum slew rate | 0.06 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 11.43 mm |
| AM27H256-55/BUA | AM27H256-55/BXA | AM27H256-70/BXA | AM27H256-70/BUA | |
|---|---|---|---|---|
| Description | UVPROM, 32KX8, 55ns, CMOS, CQCC32, CERAMIC, LCC-32 | UVPROM, 32KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 | UVPROM, 32KX8, 70ns, CMOS, CDIP28, CERAMIC, DIP-28 | UVPROM, 32KX8, 70ns, CMOS, CQCC32, CERAMIC, LCC-32 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | AMD | AMD | AMD | AMD |
| Parts packaging code | QFJ | DIP | DIP | QFJ |
| package instruction | WQCCN, LCC32,.45X.55 | WDIP, DIP28,.6 | WDIP, DIP28,.6 | WQCCN, LCC32,.45X.55 |
| Contacts | 32 | 28 | 28 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 55 ns | 55 ns | 70 ns | 70 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-CQCC-N32 | R-GDIP-T28 | R-GDIP-T28 | R-CQCC-N32 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| length | 13.97 mm | 37.1475 mm | 37.1475 mm | 13.97 mm |
| memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| Memory IC Type | UVPROM | UVPROM | UVPROM | UVPROM |
| memory width | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 28 | 28 | 32 |
| word count | 32768 words | 32768 words | 32768 words | 32768 words |
| character code | 32000 | 32000 | 32000 | 32000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | WQCCN | WDIP | WDIP | WQCCN |
| Encapsulate equivalent code | LCC32,.45X.55 | DIP28,.6 | DIP28,.6 | LCC32,.45X.55 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | CHIP CARRIER, WINDOW |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Programming voltage | 12.75 V | 12.75 V | 12.75 V | 12.75 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| Maximum seat height | 3.556 mm | 5.588 mm | 5.588 mm | 3.556 mm |
| Maximum standby current | 0.035 A | 0.035 A | 0.035 A | 0.035 A |
| Maximum slew rate | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | QUAD | DUAL | DUAL | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 11.43 mm | 15.24 mm | 15.24 mm | 11.43 mm |
京公网安备 11010802033920号
EEWORLD
