EEWORLDEEWORLDEEWORLD

Part Number

Search

239-75ABE-03

Description
Heat Sink, Clip, Foldedback, Aluminum, Anodized
CategoryThermal management products    Heat resisting bracing   
File Size2MB,23 Pages
ManufacturerWakefield-Vette
Websitehttp://www.wakefield-vette.com/
Download Datasheet Parametric View All

239-75ABE-03 Overview

Heat Sink, Clip, Foldedback, Aluminum, Anodized

239-75ABE-03 Parametric

Parameter NameAttribute value
Reach Compliance Codecompli
Main materialALUMINUM
colorBLACK
structureCLIP
fin directionFOLDEDBACK
Surface layerANODIZED
high19.1 mm
length28.4 mm
Heat Resistant Support Device TypeHEAT SINK
width11.1 mm
Base Number Matches1
WTS001_p1-25
6/14/07
10:54 AM
Page 22
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES
Surface Mount Heat Sinks
D
2
PAK, TO-220, SOT-223, SOL-20
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a vari-
ety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increas-
ing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
component thermal specifications.
FEATURES AND BENEFITS:
• No interface material is needed
• Copper with matte tin plating for improved solderability and assembly
• Both the component and the heat sink are installed on the PC-board utilizing
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
• EIA standards and ESD protection are specified
• Can be used with water soluble or no clean SMT solder creams or other pastes
Standard
P/N
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
Package
Format
Bulk
Tube
Tape & Reel
Package
Quantity
1
20
250
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection)
55°C @ 1W
55°C @ 1W
55°C @ 1W
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
217-36CTE6
.360 (9.1)
217-36CTTE6
.360 (9.1)
217-36CTRE6
.360 (9.1)
Material: Copper, Matte Tin Plated
MECHANICAL DIMENSIONS
217 HEAT SINK WITH
DDPAK DEVICE
THERMAL PERFORMANCE
6 LAYER BOARD, D' PAK
125°C LEAD, 40°C AMBIENT
217-36CT6
Device Tab dT, C
Device Power Dissipation. W
KEY:
í
Device only, NC
v
Device + HS, NC
Device + HS, 100 lfm
„
Device + HS, 200 lfm
Device + HS, 300 lfm
SECTION A-A
NOTES
1. Material to be “ESD”
2. Approximately 6 Meters per Reel
3. 250 Pieces per Reel.
217-36CTR6
TAPE DETAILS
REEL DETAILS
Dimensions: in.
22
The problem of Android emulator's navigation keys not working well
The navigation keys, up, down, left, right and confirmation keys on my Android emulator do not respond. Does anyone know what the problem is? Is it because the version is too high and not supported? I...
chenbingjy Linux and Android
First meeting
I am very happy to share the joy of learning embedded systems with you....
ljm945 Talking about work
Questions about data conversion
[table=98%,rgb(209, 217, 226)] [tr][td] [/td][td]DBH[/td][td]DBL[/td][/tr] [tr][td]Before conversion[/td][td]0 0 0 0 D11 D10 D9 D8[/td][td]D7 D6 D5 D4 D3 D2 D1 D0[/td][/tr] [tr][td]After conversion[/t...
功夫佬 51mcu
FPGA-based SATA controller.doc
FPGA-based SATA controller.doc...
zxopenljx FPGA/CPLD
EDA experiment and practice dac_test
module dac_test(clock,key,wr_act,wr_data,seg,dig); input clock; //system clock (48MHz) input[4:0] key; //key input (KEY1~KEY5) output wr_act; //data enable output[10:0]wr_data; //data to be sent outpu...
白丁 FPGA/CPLD

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2790  168  824  2577  1740  57  4  17  52  36 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号