2.5 mm x 3.2 mm Ceramic Package SMD TCXO
I547/I747 Series
Product Features:
Clipped Sinewave
Analog Compensation
Available
0.5ppm
Stability
RoHS Compliant / Pb-free
Applications:
GPS
Smart Meters
Wireless Base Stations
Sonet / SDH
T1/E1, T3/E3
10MHz to 52MHz
2.0ppm
after second reflow
See Part Numbering Guide
0.2ppm
Maximum
0.2ppm
Maximum
0.8V p-p Minimum
10KOhms / 10 pF
3.0mSec Maximum
1ppm
/ Year Maximum
See Part Numbering Guide, tolerance
5%
1.5mA Maximum
2.0mA Maximum
1.5Vdc
1.0Vdc,
5.0ppm Minimum (Only for I747)
See Part Numbering Guide
-40C to +85C
-87 dBc/Hz at 10Hz
-112 dBc/Hz at 100Hz
-135 dBc/Hz at 1KHz
-145 dBc/Hz at 10KHz
Analog
Suggested Land Pattern
Frequency
Frequency Tolerance @ 25 C
Frequency Stability
Vs Temperature
Vs Supply Voltage ( 5%)
Vs Load (10%)
Output Level
Clipped Sinewave
Output Load
Clipped Sinewave
Start Time (90% of Vp-p)
Aging
Supply Voltage
Current
<32MHz
>32mHz
Voltage Control
Operating Temperature Range
Storage Temperature Range
Phase Noise (typical)
Compensation
Dimensions in mm
Part Numbering Guide
Sample Part Number: I547-1Q3-20.000 MHz
Package
Operating Temperature
7 = 0C to +50C
1 = 0C to +70C
I547 (Clipped Sinewave TCXO)
I747 (Clipped Sinewave TCVCXO)
3 = -20C to +70C
5 = -30C to +85C
2 = -40C to +85C
FrequencyStability vs Temperature
*, ** Y = ±0.5ppm
*N =
1.0ppm
*O =
1.5ppm
*P =
2.0ppm
Q =
2.5ppm
R =
3.0ppm
J =
5.0ppm
Supply Voltage
3 = 3.3V
7 = 3.0V
8 = 2.8V
2 = 2.7V
1 = 1.8V
Frequency
- 20.000 MHz
*
Not available for all frequencies or temperature ranges.
**
Referenced to the midpoint between minimum and maximum frequency value over Operating Temperature Range.
NOTE:
It is recommended that a 0.01µF bypass capacitor be connected between Vdd (Pin 4) and Ground (Pin 2) to minimize power supply noise.
It is recommended that an external 0.01µF AC-coupling capacitor be connected to output (Pin 3) of the device.
For the TXCO (I547), it is recommended that Pin 1 should not be left floating but be connected to Ground.
Rev: 12/13/17_M
Page 1 of 2
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●
www.ilsiamerica.com
Specifications subject to change without notice
2.5 mm x 3.2 mm Ceramic Package SMD TCXO
I547/I747 Series
Pb Free Solder Reflow Profile:
Ts max to T
L
(Ramp-up Rate)
Preheat
Temperature min (Ts min)
Temperature typ (Ts typ)
Temperature max (Ts max)
Time (Ts)
Ramp-up Tate (T
L
to Tp
Time Maintained Above
Temperature (T
L
)
Time (T
L)
Peak Temperature (Tp)
Time within 5ºC to Peak
Temperature (Tp)
Ramp-down Rate
Tune 25ºC to Peak Temperature
3ºC / second max
150ºC
175ºC
200ºC
60 to180 seconds
3ºC / second max
217ºC
60 to 150 seconds
260ºC max for 10
seconds
20 to 40 seconds
6ºC / second max
8 minutes max
Units are backward compatible with +240°C reflow processes
Package Information:
MSL = 1 (package does not contain plastic, storage life is unlimited under normal room conditions)
Termination = e4 (Au over Ni over W base metallization)
Tape and Reel Information:
PITCH
TAPE WIDTH
REEL DIA
QTY PER REEL
4.00
8.00
180
3,000
Tape and Reel Information:
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS Compliant
JESD22-B102 Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking:
Line 1: I-Date Code (YWW)
Line 2: Frequency
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 12/13/17_M
Page 2 of 2
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