
Consumer Circuit, PDSO28, POWER, HSOP-28
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | ROHM Semiconductor |
| Parts packaging code | SOIC |
| package instruction | POWER, HSOP-28 |
| Contacts | 28 |
| Reach Compliance Code | compliant |
| Commercial integrated circuit types | CONSUMER CIRCUIT |
| JESD-30 code | R-PDSO-G28 |
| JESD-609 code | e3/e2 |
| length | 18.5 mm |
| Number of terminals | 28 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HSSOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| Maximum seat height | 2.41 mm |
| Maximum slew rate | 14.5 mA |
| Maximum supply voltage (Vsup) | 12 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| surface mount | YES |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN/TIN COPPER |
| Terminal form | GULL WING |
| Terminal pitch | 0.8 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 10 |
| width | 7.5 mm |

| BA6997FM-E2 | BA6997FP-E2 | |
|---|---|---|
| Description | Consumer Circuit, PDSO28, POWER, HSOP-28 | Consumer Circuit, PDSO28, POWER, HSOP-28 |
| Is it lead-free? | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to |
| Maker | ROHM Semiconductor | ROHM Semiconductor |
| Parts packaging code | SOIC | SOIC |
| package instruction | POWER, HSOP-28 | POWER, HSOP-28 |
| Contacts | 28 | 28 |
| Reach Compliance Code | compliant | compliant |
| Commercial integrated circuit types | CONSUMER CIRCUIT | CONSUMER CIRCUIT |
| JESD-30 code | R-PDSO-G28 | R-PDSO-G28 |
| JESD-609 code | e3/e2 | e3/e2 |
| length | 18.5 mm | 18.5 mm |
| Number of terminals | 28 | 28 |
| Maximum operating temperature | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | HSSOP | HSSOP |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 260 | 260 |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 2.41 mm | 2.41 mm |
| Maximum slew rate | 14.5 mA | 14.5 mA |
| Maximum supply voltage (Vsup) | 12 V | 12 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V |
| surface mount | YES | YES |
| Temperature level | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | TIN/TIN COPPER | TIN/TIN COPPER |
| Terminal form | GULL WING | GULL WING |
| Terminal pitch | 0.8 mm | 0.8 mm |
| Terminal location | DUAL | DUAL |
| Maximum time at peak reflow temperature | 10 | 10 |
| width | 7.5 mm | 7.5 mm |