Bus Driver, FCT Series, 2-Func, 4-Bit, True Output, CMOS, CDIP20, 0.300 INCH, HERMETIC SEALED, CERDIP-20
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Pyramid Semiconductor Corporation |
| Parts packaging code | DIP |
| package instruction | DIP, DIP24,.3 |
| Contacts | 20 |
| Reach Compliance Code | unknown |
| Other features | I/PS CAN BE DRIVEN BY 3.3V OR 5V COMPONENTS; MULTIPLE CENTER PIN VCC AND GND |
| Control type | ENABLE LOW |
| series | FCT |
| JESD-30 code | R-GDIP-T20 |
| JESD-609 code | e0 |
| length | 25.146 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | BUS DRIVER |
| MaximumI(ol) | 0.064 A |
| Number of digits | 4 |
| Number of functions | 2 |
| Number of ports | 2 |
| Number of terminals | 20 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output characteristics | 3-STATE |
| Output polarity | TRUE |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3 V |
| Prop。Delay @ Nom-Sup | 4.1 ns |
| propagation delay (tpd) | 4.1 ns |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 3.5 V |
| Minimum supply voltage (Vsup) | 3.1 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| P74FCT3944CD | P74FCT3944DP | P74FCT3944DD | P74FCT3944CP | P74FCT3944CSO | P74FCT3944DSO | P54FCT3944CDM | P54FCT3944DDM | |
|---|---|---|---|---|---|---|---|---|
| Description | Bus Driver, FCT Series, 2-Func, 4-Bit, True Output, CMOS, CDIP20, 0.300 INCH, HERMETIC SEALED, CERDIP-20 | Bus Driver, FCT Series, 2-Func, 4-Bit, True Output, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Bus Driver, FCT Series, 2-Func, 4-Bit, True Output, CMOS, CDIP20, 0.300 INCH, HERMETIC SEALED, CERDIP-20 | Bus Driver, FCT Series, 2-Func, 4-Bit, True Output, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Bus Driver, FCT Series, 2-Func, 4-Bit, True Output, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOIC-24 | Bus Driver, FCT Series, 2-Func, 4-Bit, True Output, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOIC-24 | Bus Driver, FCT Series, 2-Func, 4-Bit, True Output, CMOS, CDIP20, 0.300 INCH, HERMETIC SEALED, CERDIP-20 | Bus Driver, FCT Series, 2-Func, 4-Bit, True Output, CMOS, CDIP20, 0.300 INCH, HERMETIC SEALED, CERDIP-20 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation |
| Parts packaging code | DIP | DIP | DIP | DIP | SOIC | SOIC | DIP | DIP |
| package instruction | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | SOP, SOP24,.4 | SOP, SOP24,.4 | DIP, DIP24,.3 | DIP, DIP24,.3 |
| Contacts | 20 | 24 | 20 | 24 | 24 | 24 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Other features | I/PS CAN BE DRIVEN BY 3.3V OR 5V COMPONENTS; MULTIPLE CENTER PIN VCC AND GND | I/PS CAN BE DRIVEN BY 3.3V OR 5V COMPONENTS; MULTIPLE CENTER PIN VCC AND GND | I/PS CAN BE DRIVEN BY 3.3V OR 5V COMPONENTS; MULTIPLE CENTER PIN VCC AND GND | I/PS CAN BE DRIVEN BY 3.3V OR 5V COMPONENTS; MULTIPLE CENTER PIN VCC AND GND | I/PS CAN BE DRIVEN BY 3.3V OR 5V COMPONENTS; MULTIPLE CENTER PIN VCC AND GND | I/PS CAN BE DRIVEN BY 3.3V OR 5V COMPONENTS; MULTIPLE CENTER PIN VCC AND GND | I/PS CAN BE DRIVEN BY 3.3V OR 5V COMPONENTS; MULTIPLE CENTER PIN VCC AND GND | I/PS CAN BE DRIVEN BY 3.3V OR 5V COMPONENTS; MULTIPLE CENTER PIN VCC AND GND |
| Control type | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| series | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT |
| JESD-30 code | R-GDIP-T20 | R-PDIP-T24 | R-GDIP-T20 | R-PDIP-T24 | R-PDSO-G24 | R-PDSO-G24 | R-GDIP-T20 | R-GDIP-T20 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 25.146 mm | 31.9405 mm | 25.146 mm | 31.9405 mm | 15.4 mm | 15.4 mm | 25.146 mm | 25.146 mm |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| MaximumI(ol) | 0.064 A | 0.064 A | 0.064 A | 0.064 A | 0.064 A | 0.064 A | 0.048 A | 0.048 A |
| Number of digits | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of ports | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 20 | 24 | 20 | 24 | 24 | 24 | 20 | 20 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP | DIP | DIP | SOP | SOP | DIP | DIP |
| Encapsulate equivalent code | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | SOP24,.4 | SOP24,.4 | DIP24,.3 | DIP24,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Sup | 4.1 ns | 3.5 ns | 3.5 ns | 4.1 ns | 4.1 ns | 3.5 ns | 4.6 ns | 4.1 ns |
| propagation delay (tpd) | 4.1 ns | 3.5 ns | 3.5 ns | 4.1 ns | 4.1 ns | 3.5 ns | 4.6 ns | 4.1 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 4.318 mm | 5.08 mm | 4.318 mm | 2.65 mm | 2.65 mm | 5.08 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 3.5 V | 3.5 V | 3.5 V | 3.5 V | 3.5 V | 3.5 V | 3.5 V | 3.5 V |
| Minimum supply voltage (Vsup) | 3.1 V | 3.1 V | 3.1 V | 3.1 V | 3.1 V | 3.1 V | 3.1 V | 3.1 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | NO | NO | NO | NO | YES | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.5 mm | 7.5 mm | 7.62 mm | 7.62 mm |
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