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IRKT41-04

Description
62.8A, 400V, SCR, TO-240AA
CategoryAnalog mixed-signal IC    Trigger device   
File Size229KB,10 Pages
ManufacturerInternational Rectifier ( Infineon )
Websitehttp://www.irf.com/
Download Datasheet Parametric View All

IRKT41-04 Overview

62.8A, 400V, SCR, TO-240AA

IRKT41-04 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerInternational Rectifier ( Infineon )
package instructionFLANGE MOUNT, R-PUFM-X7
Reach Compliance Codeunknown
Shell connectionISOLATED
ConfigurationSERIES CONNECTED, 2 ELEMENTS
Maximum DC gate trigger current100 mA
Maximum DC gate trigger voltage2.5 V
Quick connection description2G-2GR
Description of screw terminalsA-K-AK
Maximum holding current200 mA
JEDEC-95 codeTO-240AA
JESD-30 codeR-PUFM-X7
Maximum leakage current15 mA
On-state non-repetitive peak current890 A
Number of components2
Number of terminals7
Maximum on-state current40000 A
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Certification statusNot Qualified
Maximum rms on-state current62.8 A
Maximum repetitive peak off-state leakage current15000 µA
Off-state repetitive peak voltage400 V
Repeated peak reverse voltage400 V
surface mountNO
Terminal formUNSPECIFIED
Terminal locationUPPER
Trigger device typeSCR
Bulletin I27131 rev. G 10/02
IRK.41, .56 SERIES
THYRISTOR/ DIODE and
THYRISTOR/ THYRISTOR
Features
High Voltage
Industrial Standard Package
Thick Al metal die and double stick bonding
Thick copper baseplate
UL E78996 approved
3500V
RMS
isolating voltage
ADD-A-pak
TM
GEN V Power Modules
Benefits
Up to 1600V
Full compatible TO-240AA
High Surge capability
Easy Mounting on heatsink
Al
2
0
3
DBC insulator
Heatsink grounded
45 A
60 A
Mechanical Description
The Generation V of Add-A-pak module combine the
excellent thermal performance obtained by the usage of
Direct Bonded Copper substrate with superior
mechanical ruggedness, thanks to the insertion of a
solid Copper baseplate at the bottom side of the device.
The Cu baseplate allow an easier mounting on the
majority of heatsink with increased tolerance of surface
roughness and improve thermal spread.
The Generation V of AAP module is manufactured
without hard mold, eliminating in this way any possible
direct stress on the leads.
The electrical terminals are secured against axial pull-out:
they are fixed to the module housing via a click-stop
feature already tested and proved as reliable on other IR
modules.
Electrical Description
These modules are intended for general purpose high
voltage applications such as high voltage regulated power
supplies, lighting circuits, temperature and motor speed
control circuits, UPS and battery charger.
Major Ratings and Characteristics
Parameters
I
T(AV)
or I
F(AV)
@ 85°C
I
O(RMS)
(*)
I
TSM
@ 50Hz
I
FSM
@ 60Hz
I
2
t
@ 50Hz
@ 60Hz
I
2
√t
V
RRM
range
T
STG
T
J
(*) As AC switch.
IRK.41
45
100
850
890
3.61
3.30
36.1
IRK.56
60
135
1310
1370
8.50
7.82
85.0
Units
A
A
A
A
KA
2
s
KA
2
s
KA
2
√s
V
o
400 to 1600
- 40 to 125
- 40 to125
C
C
o
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