Power Bipolar Transistor, 3A I(C), 30V V(BR)CEO, 1-Element, NPN, Silicon, TO-126, Plastic/Epoxy, 3 Pin, PLASTIC PACKAGE-3
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | SIP |
| package instruction | FLANGE MOUNT, R-PSFM-T3 |
| Contacts | 3 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Maximum collector current (IC) | 3 A |
| Collector-emitter maximum voltage | 30 V |
| Configuration | SINGLE |
| Minimum DC current gain (hFE) | 100 |
| JEDEC-95 code | TO-126 |
| JESD-30 code | R-PSFM-T3 |
| JESD-609 code | e0 |
| Number of components | 1 |
| Number of terminals | 3 |
| Package body material | PLASTIC/EPOXY |
| Package shape | RECTANGULAR |
| Package form | FLANGE MOUNT |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Polarity/channel type | NPN |
| Certification status | Not Qualified |
| surface mount | NO |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal location | SINGLE |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Transistor component materials | SILICON |
| Nominal transition frequency (fT) | 50 MHz |
| Base Number Matches | 1 |

| 2SD882-O | 2SD882-GR | 2SD882-R | 2SD882-R-B | 2SD882-Y | 2SD882 | 2SD882-O-B | 2SD882-BP | |
|---|---|---|---|---|---|---|---|---|
| Description | Power Bipolar Transistor, 3A I(C), 30V V(BR)CEO, 1-Element, NPN, Silicon, TO-126, Plastic/Epoxy, 3 Pin, PLASTIC PACKAGE-3 | Power Bipolar Transistor, 3A I(C), 30V V(BR)CEO, 1-Element, NPN, Silicon, TO-126, Plastic/Epoxy, 3 Pin, PLASTIC PACKAGE-3 | Small Signal Bipolar Transistor, 1-Element, Silicon, TO-126, PLASTIC PACKAGE-3 | Transistor | Power Bipolar Transistor, 3A I(C), 30V V(BR)CEO, 1-Element, NPN, Silicon, TO-126, Plastic/Epoxy, 3 Pin, PLASTIC PACKAGE-3 | Power Bipolar Transistor, 1-Element, Silicon, TO-126, Plastic/Epoxy, 3 Pin, PLASTIC PACKAGE-3 | Transistor | Power Bipolar Transistor, 3A I(C), 30V V(BR)CEO, 1-Element, NPN, Silicon, TO-126, Plastic/Epoxy, 3 Pin, PLASTIC PACKAGE-3 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | conform to |
| package instruction | FLANGE MOUNT, R-PSFM-T3 | FLANGE MOUNT, R-PSFM-T3 | FLANGE MOUNT, R-PSFM-T3 | , | FLANGE MOUNT, R-PSFM-T3 | FLANGE MOUNT, R-PSFM-T3 | , | PLASTIC PACKAGE-3 |
| Reach Compliance Code | compli | compli | compli | unknow | compli | compli | unknow | _compli |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e3 |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | Matte Tin (Sn) |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Parts packaging code | SIP | SIP | SIP | - | SIP | SIP | - | SIP |
| Contacts | 3 | 3 | 3 | - | 3 | 3 | - | 3 |
| ECCN code | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | - | EAR99 |
| Configuration | SINGLE | SINGLE | SINGLE | - | SINGLE | SINGLE | - | SINGLE |
| JEDEC-95 code | TO-126 | TO-126 | TO-126 | - | TO-126 | TO-126 | - | TO-126 |
| JESD-30 code | R-PSFM-T3 | R-PSFM-T3 | R-PSFM-T3 | - | R-PSFM-T3 | R-PSFM-T3 | - | R-PSFM-T3 |
| Number of components | 1 | 1 | 1 | - | 1 | 1 | - | 1 |
| Number of terminals | 3 | 3 | 3 | - | 3 | 3 | - | 3 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| Package form | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT | - | FLANGE MOUNT | FLANGE MOUNT | - | FLANGE MOUNT |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified |
| surface mount | NO | NO | NO | - | NO | NO | - | NO |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE |
| Terminal location | SINGLE | SINGLE | SINGLE | - | SINGLE | SINGLE | - | SINGLE |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| Transistor component materials | SILICON | SILICON | SILICON | - | SILICON | SILICON | - | SILICON |