8-BIT, MROM, 8MHz, MICROCONTROLLER, PDSO20, 0.300 INCH, PLASTIC, SOP-20
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | STMicroelectronics |
| Parts packaging code | SOIC |
| package instruction | 0.300 INCH, PLASTIC, SOP-20 |
| Contacts | 20 |
| Reach Compliance Code | not_compliant |
| Has ADC | YES |
| Address bus width | |
| bit size | 8 |
| CPU series | ST6200 |
| maximum clock frequency | 8 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | |
| JESD-30 code | R-PDSO-G20 |
| JESD-609 code | e0 |
| length | 12.8 mm |
| Number of I/O lines | 12 |
| Number of terminals | 20 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| PWM channel | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP20,.4 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3/5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 64 |
| rom(word) | 1036 |
| ROM programmability | MROM |
| Maximum seat height | 2.85 mm |
| speed | 8 MHz |
| Maximum supply voltage | 6 V |
| Minimum supply voltage | 3 V |
| Nominal supply voltage | 3.3 V |
| surface mount | YES |
| technology | HCMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.5 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| ST6209BM1/XXX | ST6209BB1/XXX | ST6209BB6/XXX | ST6209BM6/XXX | |
|---|---|---|---|---|
| Description | 8-BIT, MROM, 8MHz, MICROCONTROLLER, PDSO20, 0.300 INCH, PLASTIC, SOP-20 | 8-BIT, MROM, 8MHz, MICROCONTROLLER, PDIP20, 0.300 INCH, PLASTIC, DIP-20 | 8-BIT, MROM, 8MHz, MICROCONTROLLER, PDIP20, 0.300 INCH, PLASTIC, DIP-20 | 8-BIT, MROM, 8MHz, MICROCONTROLLER, PDSO20, 0.300 INCH, PLASTIC, SOP-20 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Parts packaging code | SOIC | DIP | DIP | SOIC |
| package instruction | 0.300 INCH, PLASTIC, SOP-20 | 0.300 INCH, PLASTIC, DIP-20 | 0.300 INCH, PLASTIC, DIP-20 | 0.300 INCH, PLASTIC, SOP-20 |
| Contacts | 20 | 20 | 20 | 20 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
| Has ADC | YES | YES | YES | YES |
| bit size | 8 | 8 | 8 | 8 |
| CPU series | ST6200 | ST6200 | ST6200 | ST6200 |
| maximum clock frequency | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| DAC channel | NO | NO | NO | NO |
| DMA channel | NO | NO | NO | NO |
| JESD-30 code | R-PDSO-G20 | R-PDIP-T20 | R-PDIP-T20 | R-PDSO-G20 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Number of I/O lines | 12 | 12 | 12 | 12 |
| Number of terminals | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 70 °C | 70 °C | 85 °C | 85 °C |
| PWM channel | NO | NO | NO | NO |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | DIP | DIP | SOP |
| Encapsulate equivalent code | SOP20,.4 | DIP20,.3 | DIP20,.3 | SOP20,.4 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 64 | 64 | 64 | 64 |
| rom(word) | 1036 | 1036 | 1036 | 1036 |
| ROM programmability | MROM | MROM | MROM | MROM |
| Maximum seat height | 2.85 mm | 3.93 mm | 3.93 mm | 2.85 mm |
| speed | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| Maximum supply voltage | 6 V | 6 V | 6 V | 6 V |
| Minimum supply voltage | 3 V | 3 V | 3 V | 3 V |
| Nominal supply voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | NO | NO | YES |
| technology | HCMOS | HCMOS | HCMOS | HCMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.5 mm | 7.62 mm | 7.62 mm | 7.5 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
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