EEWORLDEEWORLDEEWORLD

Part Number

Search

HY27US08121A-FMP

Description
Flash, 64MX8, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, FBGA-63
Categorystorage    storage   
File Size414KB,49 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric View All

HY27US08121A-FMP Overview

Flash, 64MX8, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, FBGA-63

HY27US08121A-FMP Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSK Hynix
Parts packaging codeBGA
package instructionVFBGA,
Contacts63
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Maximum access time30 ns
JESD-30 codeR-PBGA-B63
length11 mm
memory density536870912 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals63
word count67108864 words
character code64000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-30 °C
organize64MX8
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Programming voltage3.3 V
Certification statusNot Qualified
Maximum seat height1 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
typeSLC NAND TYPE
width9 mm
HY27US(08/16)121A Series
HY27SS(08/16)121A Series
512Mbit (64Mx8bit / 32Mx16bit) NAND Flash
Document Title
512Mbit (64Mx8bit / 32Mx16bit) NAND Flash Memory
Revision History
Revision
No.
0.0
Initial Draft.
History
Draft Date
Sep. 2004
Remark
Preliminary
0.1
1) Correct part number ( change mode)
- 2A -> 1A (sequential row read : disable -> enable)
2) Correct Table.5 & Table 12
- Correct Command Set
- correct AC timing characteristics (tWP : 40 -> 25ns, tWH : 20 ->15ns)
3) Correct Summary description & page.7
- The cache feature is deleted in summary description.
Oct. 22. 2004
- Note.3 is deleted. (page.7)
4) Add System interface using CE don’t care (page. 38)
5) Change TSOP1, WSOP1,FBGA package dimension & figures.
- Change TSOP1, WSOP1, FBGA package mechanical data
- Change TSOP1, WSOP package figures
6) Correct TSOP1, WSOP1 Pin configuration
- 38th NC pin has been changed Lockpre (figure 2,3)
7) Add Bad block Management
1) LOCKPRE is changed to PRE
- Texts, Table and figures are changed.
2) Change Command set
- Read A,B are changed to Read1.
- Read C is changed to Read2.
3) Change AC, DC characterics
Preliminary
0.2
- tRB, tCRY, tCEH and tOH are added.
4) Correct Program time (max)
- before : 700us
- after
: 500us
5) Edit figures
- Address names are changed.
6) Change FBGA Package Dimension
- FD1 : 1.70(before) -> 0.90(after)
Mar. 08. 2005 Preliminary
Rev 1.3 / Jun. 2006
1
How to share USB/CAN of STM32F103? (Circuit design question)
I would like to ask if the USB/CAN port of STM32 can be remapped, can the interface circuit (CAN transceiver/USB bus) realize the coexistence of two applications but not at the same time: that is, whe...
hyforwin stm32/stm8
Problems with the IA4421 wireless module
#include "reg52.h" #include "uart.h" sbit sdi=P1^4; sbit sck= P1^5; sbit value = P1^6; sbit sdo= P1^7; unsigned char workflag; unsigned char rxdata[16]; //16, unsigned char txdata[16]; //16,empty keyb...
410598605 Embedded System
This week's highlights
[b][url=http://www.deyisupport.com/blog/b/analogwire/archive/2017/09/30/tas2560.aspx]How to use TAS2560 on Qualcomm platform for mobile phone applications[/url][/b][font=微软雅黑][size=3][color=#000000]Wi...
橙色凯 Analogue and Mixed Signal
This code is used in dll, g_hInst, videownd is passed from outside. IDD_CAMERA_DIALOG is a resource in dll, why doesn't it work?
This code is used in dll, g_hInst, videownd are passed from outside. IDD_CAMERA_DIALOG is a resource in dll, why doesn't it work? If IDD_CAMERA_DIALOG is also passed from outside, it will work.DialogB...
cd001 Embedded System
The design path of a hardware engineer
After a rare two-day break, I returned to work. The first thing I did was to help my wife translate a paper. Although the work at hand was full of challenges, I was able to cope with it overall. Since...
eeleader Talking about work

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1076  130  705  737  265  22  3  15  6  52 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号