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FDB6030BLL86Z

Description
Power Field-Effect Transistor, 40A I(D), 30V, 0.018ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, D2PAK-3
CategoryDiscrete semiconductor    The transistor   
File Size381KB,10 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
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FDB6030BLL86Z Overview

Power Field-Effect Transistor, 40A I(D), 30V, 0.018ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, D2PAK-3

FDB6030BLL86Z Parametric

Parameter NameAttribute value
MakerFairchild
Parts packaging codeD2PAK
package instructionSMALL OUTLINE, R-PSSO-G2
Contacts3
Reach Compliance Codeunknown
ECCN codeEAR99
Avalanche Energy Efficiency Rating (Eas)150 mJ
Shell connectionDRAIN
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage30 V
Maximum drain current (ID)40 A
Maximum drain-source on-resistance0.018 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JEDEC-95 codeTO-263AB
JESD-30 codeR-PSSO-G2
Number of components1
Number of terminals2
Operating modeENHANCEMENT MODE
Maximum operating temperature175 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Polarity/channel typeN-CHANNEL
Maximum pulsed drain current (IDM)120 A
Certification statusNot Qualified
surface mountYES
Terminal formGULL WING
Terminal locationSINGLE
transistor applicationsSWITCHING
Transistor component materialsSILICON
FDP6030BL/FDB6030BL
July 2000
FDP6030BL/FDB6030BL
N-Channel Logic Level PowerTrench
MOSFET
General Description
This N-Channel Logic Level MOSFET has been designed
specifically to improve the overall efficiency of DC/DC
converters using either synchronous or conventional
switching PWM controllers.
These MOSFETs feature faster switching and lower gate
charge than other MOSFETs with comparable R
DS(on)
specifications resulting in DC/DC power supply designs
with higher overall efficiency.
Features
• 40 A, 30 V. R
DS(ON)
= 0.018
@ V
GS
= 10 V
R
DS(ON)
= 0.024
@ V
GS
= 4.5 V.
• Critical DC electrical parameters specified at elevated
temperature.
• Rugged internal source-drain diode can eliminate the
need for an external Zener diode transient suppressor.
• High performance trench technology for
extremely low R
DS(ON)
.
• 175°C maximum junction temperature rating.
D
D
G
G
D
S
TO-220
FDP Series
G
S
T
C
= 25°C unless otherwise noted
TO-263AB
FDB Series
S
Absolute Maximum Ratings
Symbol
V
DSS
V
GSS
I
D
P
D
T
J
, T
STG
R
θ
JC
R
θ
JA
Drain-Source Voltage
Gate-Source Voltage
Maximum Drain Current
Parameter
FDP6030BL
FDB6030BL
30
±
20
Units
V
V
A
W
W/
°
C
°
C
°
C/W
°
C/W
- Continuous
- Pulsed
(Note 1)
40
120
60
0.36
-65 to +175
Total Power Dissipation @ T
C
= 25
°
C
Derate above 25
°
C
Operating and Storage Junction Temperature Range
Thermal Characteristics
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient
2.5
62.5
Package Marking and Ordering Information
Device Marking
FDB6030BL
FDP6030BL
Device
FDB6030BL
FDP6030BL
Reel Size
13’’
Tube
Tape Width
24mm
N/A
Quantity
800
45
200
Fairchild Semiconductor International
FDP6030BL/FDB6030BL Rev.C

FDB6030BLL86Z Related Products

FDB6030BLL86Z FDP6030BLS62Z
Description Power Field-Effect Transistor, 40A I(D), 30V, 0.018ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, D2PAK-3 Power Field-Effect Transistor, 40A I(D), 30V, 0.018ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB, TO-220, 3 PIN
Maker Fairchild Fairchild
Parts packaging code D2PAK TO-220AB
package instruction SMALL OUTLINE, R-PSSO-G2 FLANGE MOUNT, R-PSFM-T3
Contacts 3 3
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
Avalanche Energy Efficiency Rating (Eas) 150 mJ 150 mJ
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage 30 V 30 V
Maximum drain current (ID) 40 A 40 A
Maximum drain-source on-resistance 0.018 Ω 0.018 Ω
FET technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95 code TO-263AB TO-220AB
JESD-30 code R-PSSO-G2 R-PSFM-T3
Number of components 1 1
Number of terminals 2 3
Operating mode ENHANCEMENT MODE ENHANCEMENT MODE
Maximum operating temperature 175 °C 175 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE FLANGE MOUNT
Polarity/channel type N-CHANNEL N-CHANNEL
Maximum pulsed drain current (IDM) 120 A 120 A
Certification status Not Qualified Not Qualified
surface mount YES NO
Terminal form GULL WING THROUGH-HOLE
Terminal location SINGLE SINGLE
transistor applications SWITCHING SWITCHING
Transistor component materials SILICON SILICON

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