05224
PRSB6.8C
Only One Name Means ProT
ek’Tion™
ST
ANDARD TVS COMPONENTS
APPLICA
TIONS
✔
✔
✔
✔
✔
Noise Suppression for Data Lines
Laptop Computers
Cellular Phones
Digital Cameras
Personal Digital Assistants (PDAs)
IEC COMPA
TIBILITY
(EN61000-4)
✔
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔
61000-4-4 (EFT): 40A - 5/50ns
FEA
TURES
✔
10 Watts Peak Pulse Power per Line (tp = 10/1000µs)
✔
ESD Protection > 40 kilovolts
✔
Bidirectional Configuration
✔
Protects One Data Line
✔
Low Clamping Voltage
✔
Easy Placement for Manufacturing
✔
LOW CAPACITANCE
✔
RoHS Compliant in Lead-Free Versions
MECHANICAL CHARACTERISTICS
✔
✔
✔
✔
DFN-2 Package
Weight 0.73 milligrams (Approximate)
Available in Tin-Lead or Lead-Free Pure-Tin Plating(Annealed)
Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245°C
Pure-Tin - Sn, 100: 260-270°C
✔
Flammability Rating UL 94V-0
✔
8mm Tape and Reel Per EIA Standard 481
✔
Device Part Number on Reel & Marking Code on Device
PIN CONFIGURA
TION
05224.R3 9/05
1
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PRSB6.8C
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
Peak Pulse Power (t
p
= 10/1000µs) - See Figure 1
Power Dissipation
Junction Temperature
Storage Temperature
Operation Temperature
SYMBOL
P
Pk
P
T
J
T
stg
T
opr
VALUE
10
150
150
-55 to 150
-50 to 150
UNITS
W
mW
°C
°C
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
DEVICE
MARKING
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
LEAKAGE
CURRENT
TYPICAL
CAPACITANCE
V
WM
VOLTS
PRSB6.8C
A
4.7
@ 1mA
V
(BR)
VOLTS
5.7
@3.5V
I
D
µA
1.0
0V @ 1 MHz
C
pF
15
05224.R3 9/05
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PRSB6.8C
GRAPHS
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
1,000
P
PP
- Peak Pulse Power - kilowatts
100
10W 10/1000µs
Waveform
10
0
0.1
1
10
100
1,000
t
d
- Pulse Duration - µs
10,000
100,000
120
I
PP
- Peak Pulse Current - % of I
PP
FIGURE 2
PULSE WAVE FORM
t
f
Peak Value I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 10µs
t
d
= 1000µs
100
80
60
40
e
-t
t
d
= t
20
0
0
5
10
I
PP
/2
15
t - Time - µs
20
25
30
FIGURE 3
OVERSHOOT & CLAMPING VOLTAGE
30
5 Volts per Division
25
15
5
-5
ESD Test Pulse: 25 kilovolt, 1/30ns (waveshape)
05224.R3 9/05
3
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PRSB6.8C
APPLICA
TION INFORMA
TION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
VALUE
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
270°C
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-265°C
T
P
for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
T
P
Ramp-up
Temperature - °C
Ramp-down
T
L
T
SMAX
155°
T
SMIN
140°
T
S
- Preheat
t 25°C to Peak
30-60 seconds
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
05224.R3 9/05
4
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PRSB6.8C
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
A
H
C
PACKAGE DIMENSIONS
INCHES
DIM
A
B
C
D
E
F
H
NOTES
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad : ± 0.003” (±0.08mm).
3. Maximum size: 0.052” (1.321mm) by 0.036” (0.914mm).
MILLIMETERS
MAX
0.025
0.042
0.022
0.014
0.016
0.014
0.013
MIN
0.58
0.97
0.46
0.25
0.30
0.25
0.28
NOR
0.61
1.02
0.51
0.30
0.36
0.30
0.30
MAX
0.64
1.07
0.56
0.36
0.41
0.36
0.33
D
TOP
B
BOTTOM
E
SIDE
MIN
0.023
0.038
0.018
0.010
0.012
0.010
0.011
NOR
0.024
0.040
0.020
0.012
0.014
0.012
0.012
F
MOUNTING PAD
A
PAD DIMENSIONS
DIM
A
B
C
E
F
MILLIMETERS
0.762 ± 0.025
0.356 ± 0.025
0.381 ± 0.025
1.473 ± 0.050
0.559 ± 0.025
INCHES
0.030 ± 0.001
0.014 ± 0.001
0.015 ± 0.001
0.058 ± 0.002
0.022 ± 0.001
B
C
E
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T
APE & REEL ORIENT TION
A
F
TAPE & REEL ORDERING NOMENCLATURE
Solder Print Diameter
0.010” - 0.012”
NOTE
1. Top view of tape. Solder PADS face down in tape package.
Outline & Dimensions: Rev 0 - 4/05, 06059
1. Surface mount product is taped and reeled in accordance with EIA 481.
2.
8mm Plastic Tape:
7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., PRSB6.8C-T75-1).
3. Suffix - LF = Lead Free Pure-Tin Plating: i.e.,
PRSB6.8C-LF-T75-1.
Tape & Reel Specifications (Dimensions in millimeters)
Reel Dia.
178mm (7”)/330mm(13”)
Tape Width
8mm
A0
B0
K0
D
E
F
W
P0
P2
P
tmax
0.25
0.80± 0.10 1.20± 0.10 0.70 ± 0.10 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ±0.30 4.00 ±0.10 2.00 ±0.05 2.00 ±0.10
P0
t
D
P2
10 Pitches Cumulative
Tolerance on Tape. ± 0.2
E
Top cover tape
A0
K0
B0
F
W
P
User Direction of Feed
COPYRIGHT © ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
5
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05224.R3 9/05
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