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MX7537SQ/883B

Description
D/A Converter, 1 Func, Parallel, Word Input Loading, 0.8us Settling Time, CDIP24, CERAMIC, DIP-24
CategoryAnalog mixed-signal IC    converter   
File Size31KB,5 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
Download Datasheet Parametric Compare View All

MX7537SQ/883B Overview

D/A Converter, 1 Func, Parallel, Word Input Loading, 0.8us Settling Time, CDIP24, CERAMIC, DIP-24

MX7537SQ/883B Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMaxim
Parts packaging codeDIP
package instructionDIP,
Contacts24
Reach Compliance Codenot_compliant
ECCN code3A001.A.2.C
Converter typeD/A CONVERTER
Enter bit codeBINARY
Input formatPARALLEL, WORD
JESD-30 codeR-GDIP-T24
JESD-609 codee0
Maximum linear error (EL)0.0122%
Humidity sensitivity level1
Number of digits12
Number of functions1
Number of terminals24
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)245
Certification statusNot Qualified
Filter levelMIL-STD-883 Class B
Maximum seat height5.08 mm
Nominal settling time (tstl)0.8 µs
Nominal supply voltage15 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTIN LEAD
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
SCOPE:
CMOS, PARALLEL-LOADING, DUAL, MULTIPLYING 12-BIT D/A CONVERTER
Generic Number
MX7537U(x)/883B
MX7537T(x)/883B
MX7537S(x)/883B
MX7547U(x)/883B
MX7547T(x)/883B
MX7547S(x)/883B
Device Type
01
02
03
04
05
06
Case Outline(s).
The case outlines shall be designated in Mil-Std-1835 and as follows:
Outline Letter
MAXIM SMD
Q
L
E
3
Mil-Std-1835
GDIP1-T24 or CDIP2-T24
CQCC1-N28
Case Outline
Package Code
J24
L28
24 LEAD CERDIP
28 LEADLESS CHIP
Absolute Maximum Ratings:
V
DD
to DGND ........................................................................................………. -0.3V, + 17V
V
RFBA
, V
RFBB
to AGND .......................................................................................……….
±25V
V
REFA
, V
REFB
to AGND .......................................................................................……….
±25V
Digital Input Voltage to DGND .....................................................……… -0.3V, (V
DD
+0.3V)
IOUTA, IOUTB Voltage to DGND ...............................................…….... -0.3V, (V
DD
+0.3V)
AGND to DGND ............................................................................…….... -0.3V, (V
DD
+0.3V)
Lead Temperature (soldering, 10 seconds) ........................................................................ +300°C
Storage Temperature ........................................................................................... -65°C to +150°C
Continuous Power Dissipation ..........................................................................……... T
A
=+70°C
24 pin CERDIP(derate 12.5mW/°C above +70°C) ...............................................…….. 1000mW
28 pin LCC(derate 10.2mW/°C above +70°C) .......................................................…….. 816mW
Junction Temperature T
J
.....................................................................................…….... +150°C
Thermal Resistance, Junction to Case,
ΘJC
24 pin CERDIP................................................................................................…….... 40°C/W
28 pin LCC .....................................................................................................……..... 15°C/W
Thermal Resistance, Junction to Ambient,
ΘJA:
24 pin CERDIP................................................................................................…….... 80°C/W
28 pin LCC .....................................................................................................………. 98°C/W
Recommended Operating Conditions
Ambient Operating Range (T
A
) ............................................................……... -55°C to
+125°C
Logic Supply Voltage (V
LOGIC
) ................................................................……... +4.5V to +5.5V
Positive Supply Voltage (V
DD
)..............................................................……... +11.4V to +16.5V
Negative Supply Voltage (V
EE
)...............................................................……... -11.4V to -16.5V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
-----------------------
Electrical Characteristics of MX7537/47/883B for /883B
and SMD 5962-87763 and SMD 5962-89657
19-0057
Page 2 of
Rev. C
7

MX7537SQ/883B Related Products

MX7537SQ/883B MX7537SE/883B MX7537TE/883B MX7537UE/883B MX7547TQ/883B
Description D/A Converter, 1 Func, Parallel, Word Input Loading, 0.8us Settling Time, CDIP24, CERAMIC, DIP-24 D/A Converter, 1 Func, Parallel, Word Input Loading, CQCC28, CERAMIC, LCC-28 D/A Converter, 1 Func, Parallel, Word Input Loading, CQCC28, CERAMIC, LCC-28 D/A Converter, 1 Func, Parallel, Word Input Loading, CQCC28, CERAMIC, LCC-28 D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, CERAMIC, DIP-24
Maker Maxim Maxim Maxim Maxim Maxim
Parts packaging code DIP QLCC QLCC QLCC DIP
package instruction DIP, CERAMIC, LCC-28 QCCN, CERAMIC, LCC-28 CERAMIC, DIP-24
Contacts 24 28 28 28 24
Reach Compliance Code not_compliant compliant unknown compliant not_compliant
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
Converter type D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER
Enter bit code BINARY BINARY BINARY BINARY BINARY
Input format PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD
JESD-30 code R-GDIP-T24 R-CQCC-N28 R-CQCC-N28 R-CQCC-N28 R-GDIP-T24
Maximum linear error (EL) 0.0122% 0.0122% 0.0122% 0.0122% 0.0244%
Number of digits 12 12 12 12 12
Number of functions 1 1 1 1 1
Number of terminals 24 28 28 28 24
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C
Package body material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
encapsulated code DIP QCCN QCCN QCCN DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE CHIP CARRIER CHIP CARRIER CHIP CARRIER IN-LINE
Filter level MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B
Nominal supply voltage 15 V 15 V 15 V 15 V 15 V
surface mount NO YES YES YES NO
technology CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form THROUGH-HOLE NO LEAD NO LEAD NO LEAD THROUGH-HOLE
Terminal location DUAL QUAD QUAD QUAD DUAL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified -
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