Low-Power Single Schmitt-Trigger Buffer 4-DSBGA
| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Texas Instruments |
| Parts packaging code | BGA |
| package instruction | VFBGA, BGA4,2X2,16 |
| Contacts | 5 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Factory Lead Time | 1 week |
| Samacsys Descripti | LOW-POWER SINGLE SCHMITT-TRIGGER BUFFER |
| series | AUP/ULP/V |
| JESD-30 code | R-PBGA-B5 |
| JESD-609 code | e1 |
| length | 1.4 mm |
| Load capacitance (CL) | 30 pF |
| Logic integrated circuit type | BUFFER |
| MaximumI(ol) | 0.004 A |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of entries | 1 |
| Number of terminals | 5 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | VFBGA |
| Encapsulate equivalent code | BGA4,2X2,16 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| method of packing | TR |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 1.2/3.3 V |
| Maximum supply current (ICC) | 0.0009 mA |
| Prop。Delay @ Nom-Su | 19.8 ns |
| propagation delay (tpd) | 19.8 ns |
| Certification status | Not Qualified |
| Schmitt trigger | YES |
| Maximum seat height | 0.5 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 0.8 V |
| Nominal supply voltage (Vsup) | 1.2 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL |
| Terminal pitch | 0.5 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 0.9 mm |
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