IC497 Series
Specifications
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Mating Cycles:
Pin Count:
Dual Inline Memory Module
(DIMM, 144 pins)
Part Number
(Details)
1,000M
W
min. at 500V DC
700V AC for 1 minute
30m
W
max. at 10mA/20mV max.
–55°C to +170°C
10,000 insertions min.
144 contact pins
IC-497
-
1 - *
-
MF
Series No.
Design No.
Positioning
Detail
(see Section "A")
MF = Flanged
Unmarked = Not Flanged
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Features
í
Card thickness 1.00mm
í
4 different positioning indicators
Outline Socket Dimensions
Recommended PC Board Layout
Top View from Socket
101.00 ±0.2
30.10 ±0.05
0.1
Æ3.20
+ 0
30.50 ±0.05
0.80x41=32.80 ±0.2
0.80 ±0.05
30.10 ±0.05
0.80x29=23.20 ±0.1
Æ3.20
+ 0.1
0
101.00 ±0.1
30.50 ±0.05
0.80x41=32.80 ±0.1
0.80 ±0.05
(0.40)
4.60 ±0.1
144-
Æ
0.80
+ 0.1
0
0.80x29=23.20 ±0.2
(4.60±0.1)
(0.40)
17.00
13.00
7.70±0.05
4.50±0.05
0.80x29=23.20 ±0.2
30.50 ±0.1
0.80x41=32.80 ±0.2
30.10 ±0.1
+ 0.2
63.50
0
+ 0.2
67.80
0
92.00 ±0.4
110.00 ±0.4
(91.50)
(65.00)
R 0.50
0.80 ±0.05
0.80x29=23.20 ±0.1
30.50 ±0.05
(0.40)
0.80x41=32.80 ±0.1
30.10 ±0.05
17.70 ±0.1
6.00
(36.50)
0.3
11.00
+ 0
R 1.70
Matching Module Dimensions
2.00 min
4.00
Section "A"
R 2.00
(25.40~38.10)
3.50 ±0.5
4.00 ±0.1
2.55
Positioning Details
Section "A"
1.35
2.10
R - 0.55
20.00
w0.30 x t0.30
0.80
0.80
0.80x29=23.20
27.80 ±0.05
67.60 ±0.15
0.80x41=32.80
3.70
1.00 ±0.1
3.80
max
3.30
1.10
0
- 0.1
0.80
3.70
27.80 ±0.05
0.80x29=23.20
0.80x41=32.80
3.30
IC-497-1-1-**
IC-497-1-2-**
0.80
see Sec. "A"
1.50 ±0.1
0.80
2.85
Back
IC-497-1-3-**
IC-497-1-4-**
B-2
Test & Burn-In
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
3.20
Front
5.00
4.00 ±0.1
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