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SMLJ100AP

Description
DIODE 3000 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-214AB, PLASTIC, SMCJ, 2 PIN, Transient Suppressor
CategoryDiscrete semiconductor    diode   
File Size250KB,7 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance  
Download Datasheet Parametric View All

SMLJ100AP Overview

DIODE 3000 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-214AB, PLASTIC, SMCJ, 2 PIN, Transient Suppressor

SMLJ100AP Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Parts packaging codeDO-214AB
package instructionPLASTIC, SMCJ, 2 PIN
Contacts2
Reach Compliance Codeunknown
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

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$ %    !"#
SMLJ5.0
THRU
SMLJ170CA
Transient
Voltage Suppressor
5.0 to 170 Volts
3000 Watt
DO-214AB
(SMCJ) (LEAD
FRAME)
G
Features
For surface mount application in order to optimize board space
Low inductance
Low profile package
Built-in strain relief
Glass passivated junction
Excellent clamping capability
Repetition Rate( duty cycle): 0.5%
Fast response time: typical less than 1ps from 0V to BV min
Typical I
D
less than 1uA above 10V
High temperature soldering: 260 C/10 seconds at terminals
Case Material : Molded Plastic. UL Flammability
Classification
Rating
94V-0
UL Recognized File # E222849
o
H
Mechanical Data
CASE: JEDEC DO-214AB molded plastic body over
passivated junction
Terminals: solderable per MIL-STD-750, Method 2026
F
D
A
C
E
B
Polarity: Color band denotes positive end( cathode) except
Bi-directional types.
Standard packaging: 16mm tape per ( EIA 481).
Weight: 0.007 ounce, 0.21 gram
DIM
A
B
C
D
E
F
G
H
INCHES
MIN
.079
.115
.002
.006
.030
..305
.260
.220
MAX
.103
.121
.008
.012
.050
.320
.280
.245
DIMENSIONS
MM
MIN
2.00
2.92
0.051
0.152
0.76
7.75
6.60
5.59
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Peak Pulse Current on
10/1000us
waveform(Note1, Fig3)
Peak Pulse Power
Disspation on 10/1000us
waveform(Note1,2,Fig1)
Peak forward surge
current (JEDEC
Method) (Note 2,3)
Operation And Storage
Temperature Range
Thermal Resistance
Junction to Ambient&Lead
I
PPM
See Table 1
Amps
MAX
2.62
3.07
0.203
0.305
1.27
8.13
7.11
6.22
NOTE
SUGGESTED SOLDER
PAD LAYOUT
P
PPM
I
FSM
T
J
,
T
STG
R
thJA
R
thJL
Minimum
3000
Watts
0.280"
200.0
-55
o
C to
+150
o
C
75
17.5
Amps
0.121”
0.060”
O
C/W
NOTES:
o
1.
Non-repetitive current pulse per Fig.3 and derated above TA=25 C per Fig.2.
2.
Mounted on 8.0mm2 copper pads to each terminal.
3.
8.3ms, single half sine-wave or equivalent square wave, duty cycle=4 pulses per. Minutes maximum.
www.mccsemi.com
Revision: 8
1 of 7
2007/05/22
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