IC76 Series
Specifications
Shrink Dual Inline Package
(SDIP)
Part Number
(Details)
1,000M
W
min. at 500V DC
Insulation Resistance:
Dielectric Withstanding Voltage: 700V AC for 1 minute
20m
W
max. at 10mA/20mV max.
Contact Resistance:
1A max.
Current Rating:
Operating Temperature Range: –40°C to +150°C cont. (IC7612)
–40°C to +170°C cont. (IC7620)
Mating Cycles:
25,000 to 50,000 insertions
IC76
Series No.
**
-
40 06
-
G 4
MF
Housing Material
(12=PSF, 20= PES)
No. of Contact Pins
Materials and Finish
Housing: Polysulphone (PSF), glass-filled - UL94V-0 rated
Polyethersulphone (PES), glass-filled - UL94V-0 rated
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Row Space (06 = 0.6 inches)
Contact Plating (G = Gold Plating)
Straight, Through Hole Type
MF = Flanged
Unmarked = Not Flanged
Features
í
Shrink pitch (1.778mm) sockets for high-density mounting
í
Dual wipe contacts ensure high reliability
Outline Socket Dimensions
Recommended PC Board Layout
Top View from Socket
0.4
A
B
H
1.778
3.2
J
C
B
H
D
G
E
F
Pin Count
Æ0.7
(C
ontact pos.)
1.5
4.0
1.2
K
2-
Æ
3.2
2-
Æ
3.2 Spot facing (
Æ
6.2, 3.0 deep)
G
J
2-
Æ
3.2
1.778
14.5
0.5
0.3
3.0
K
2-
Æ
3.2
Part Number
IC76**-2003-G4 **
IC76**-2006-G4 **
IC76**-2203-G4 **
IC76**-2403-G4 **
IC76**-2804-G4 **
IC76**-3004-G4 **
IC76**-4006-G4 **
IC76**-4206-G4 **
IC76**-4806-G4 **
IC76**-5206-G4 **
IC76**-64075-G4**
Test & Burn-In
Pin Count
20
20
22
24
28
30
40
42
48
52
64
A
20.0
19.5
22.0
24.0
27.5
29.0
38.0
39.5
45.0
48.5
59.5
B
1.778 x 9 = 16.002
1.778 x 9 = 16.002
1.778 x 10 = 17.78
1.778 x 11 = 19.558
1.778 x 13 = 23.114
1.778 x 14 = 24.892
1.778 x 19 = 33.782
1.778 x 20 = 35.56
1.778 x 23 = 40.894
1.778 x 25 = 44.45
1.778 x 31 = 55.118
C
17.0
24.6
17.0
17.0
19.5
19.5
24.6
24.6
24.6
24.6
28.4
D
8.3
15.9
8.3
8.3
10.8
10.8
15.9
15.9
15.9
15.9
19.7
E
2.0
8.0
2.0
2.0
2.9
2.9
8.0
8.0
8.0
8.0
11.8
F
7.5
10.3
7.5
7.5
8.0
8.0
10.3
10.3
10.3
10.3
13.7
G
11.4
19.0
11.4
11.4
13.9
13.9
19.0
19.0
19.0
19.0
22.8
H
–
–
–
–
–
–
25.5
25.5
26.0
28.0
29.5
J
23.0
30.6
23.0
23.0
25.5
25.5
30.6
30.6
30.6
30.6
38.2
K
11.0
11.0
11.0
13.0
16.5
16.5
25.5
25.5
26.0
28.0
29.5
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
IC121 Series
Specifications
Shrink Dual Inline Package
(SDIP)
Part Number
(Details)
1,000M
W
min. at 500V DC
Insulation Resistance:
Dielectric Withstanding Voltage: 700V AC for 1 minute
20m
W
max. at 10mA max.
Contact Resistance:
1A max.
Current Rating:
Operating Temperature Range: –40°C to +150°C
Mating Cycles:
25,000 to 50,000 insertions
IC121
Series No.
-
52
06
-
G 4 L MF
No. of Contact Pins
Row Space (06 = 0.6 inches)
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled - UL94V-0 rated
Contacts: Copper Alloy
Plating: Gold over Nickel
Contact Plating (G = Gold Plating)
Straight Solder Dip Terminal
Terminal Length Option:
L = 5mm
Unmarked = 3mm
MF = Flanged
Unmarked = Not Flanged
Features
í
Shrink pitch (1.778mm) sockets for high-density mounting
í
Dual wipe contacts ensure high reliability
í
Two terminal lengths (3mm / 5mm) available.
The 5mm type can be used as a piggy-back socket
Outline Socket Dimensions
Recommended PC Board Layout
Top View from Socket
A
B
R 3.5
1.778
20
30
J ±0.1
D ±0.1
G
F
J
H
K
13.5
Æ3.3
Æ0.8
1.778 ±0.05
5.0
0.5
3.0
Part Number
IC121-24055-G4 **
IC121-2403-G4 **
IC121-2804-G4 **
IC121-4006-G4 **
IC121-4206-G4 **
IC121-4806-G4 **
IC121-5206-G4 **
IC121-5606-G4 **
IC121-64075-G4 **
IC121-9009-G4 **
Pin Count
24
24
28
40
42
48
52
56
64
90
A
24.50
24.00
27.50
38.20
40.00
45.50
49.00
52.50
60.00
83.54
B
19.558
19.558
23.111
33.782
35.56
40.894
44.45
48.006
55.188
78.232
C
22.80
15.00
17.0
22.8
22.8
22.8
22.8
22.8
26.8
32.2
H ±0.1
D
14.86
8.30
10.60
16.54
16.54
16.54
16.54
16.54
19.80
23.50
E
7.27
2.00
3.00
9.27
9.27
9.27
9.27
9.27
11.40
15.60
F
14.86
8.30
10.60
16.54
16.54
16.54
16.54
16.54
19.80
23.50
G
16.46
10.10
12.20
18.14
18.14
18.14
18.14
18.14
21.40
25.10
B ±0.1
1.2
Æ3.3
Hole
4.0
D
C
E
H
12.0
12.0
16.0
26.0
20.0
26.0
36.0
36.6
40.0
52.0
J
29.0
21.0
23.0
29.0
29.0
29.0
29.0
29.0
32.4
38.2
K
–
–
–
5.5
5.5
5.5
5.5
5.5
9.4
13.6
Test & Burn-In
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
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