PC74HC7403P datasheet, PDF - EEWORLD Datasheet

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PC74HC7403P: DescriptionFIFO, 64X4, 98ns, Asynchronous, CMOS, PDIP16; Categorystorage storage; File Size1023KB，26 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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PC74HC7403P Overview

FIFO, 64X4, 98ns, Asynchronous, CMOS, PDIP16

PC74HC7403P Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Maximum access time	98 ns
Maximum clock frequency (fCLK)	12 MHz
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
Memory IC Type	OTHER FIFO
memory width	4
Number of terminals	16
word count	64 words
character code	64
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
organize	64X4
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/6 V
Certification status	Not Qualified
Maximum slew rate	0.001 mA
surface mount	NO
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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PC74HC7403P Related Products

	PC74HC7403P	PC74HCT7403P	PC74HCT7403T	PC74HC7403T
Description	FIFO, 64X4, 98ns, Asynchronous, CMOS, PDIP16	FIFO, 64X4, 108ns, Asynchronous, CMOS, PDIP16	FIFO, 64X4, 108ns, Asynchronous, CMOS, PDSO16	FIFO, 64X4, 98ns, Asynchronous, CMOS, PDSO16
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	SOP, SOP16,.4	SOP, SOP16,.4
Reach Compliance Code	unknown	unknown	unknown	unknown
Maximum access time	98 ns	108 ns	108 ns	98 ns
Maximum clock frequency (fCLK)	12 MHz	12 MHz	12 MHz	12 MHz
JESD-30 code	R-PDIP-T16	R-PDIP-T16	R-PDSO-G16	R-PDSO-G16
JESD-609 code	e0	e0	e0	e0
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	4	4	4	4
Number of terminals	16	16	16	16
word count	64 words	64 words	64 words	64 words
character code	64	64	64	64
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
organize	64X4	64X4	64X4	64X4
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP	SOP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	SOP16,.4	SOP16,.4
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
power supply	2/6 V	5 V	5 V	2/6 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	0.001 mA	0.001 mA	0.001 mA	0.001 mA
surface mount	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL

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