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DS2156LN

Description
DATACOM, FRAMER, PQFP100, 14 X 14 MM, LQFP-100
CategoryWireless rf/communication    Telecom circuit   
File Size2MB,266 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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DS2156LN Overview

DATACOM, FRAMER, PQFP100, 14 X 14 MM, LQFP-100

DS2156LN Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerRochester Electronics
Parts packaging codeQFP
package instructionLFQFP,
Contacts100
Reach Compliance Codeunknown
JESD-30 codeS-PQFP-G100
JESD-609 codee0
length14 mm
Humidity sensitivity level3
Number of functions1
Number of terminals100
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)240
Certification statusCOMMERCIAL
Maximum seat height1.6 mm
Nominal supply voltage3.3 V
surface mountYES
Telecom integrated circuit typesFRAMER
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature20
width14 mm
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DS2156LN Related Products

DS2156LN DS2156L DS2156G
Description DATACOM, FRAMER, PQFP100, 14 X 14 MM, LQFP-100 DATACOM, FRAMER, PQFP100, 14 X 14 MM, LQFP-100 DATACOM, FRAMER, PBGA100, 10 MM, CSBGA-100
Is it lead-free? Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible
Maker Rochester Electronics Rochester Electronics Rochester Electronics
Parts packaging code QFP QFP BGA
package instruction LFQFP, LFQFP, FBGA,
Contacts 100 100 100
Reach Compliance Code unknown unknown unknown
JESD-30 code S-PQFP-G100 S-PQFP-G100 S-PBGA-B100
length 14 mm 14 mm 10 mm
Humidity sensitivity level 3 3 3
Number of functions 1 1 1
Number of terminals 100 100 100
Maximum operating temperature 85 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP LFQFP FBGA
Package shape SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius) 240 240 240
Certification status COMMERCIAL COMMERCIAL COMMERCIAL
Nominal supply voltage 3.3 V 3.3 V 3.3 V
surface mount YES YES YES
Telecom integrated circuit types FRAMER FRAMER FRAMER
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal surface TIN LEAD TIN LEAD NOT SPECIFIED
Terminal form GULL WING GULL WING BALL
Terminal pitch 0.5 mm 0.5 mm 0.8 mm
Terminal location QUAD QUAD BOTTOM
Maximum time at peak reflow temperature 20 20 20
width 14 mm 14 mm 10 mm
JESD-609 code e0 e0 -
Maximum seat height 1.6 mm 1.6 mm -
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