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SMBJ5376BHE3-TP

Description
Zener Diode,
CategoryDiscrete semiconductor    diode   
File Size352KB,5 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

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SMBJ5376BHE3-TP Overview

Zener Diode,

SMBJ5376BHE3-TP Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
package instructionSMB , 2 PIN
Reach Compliance Codenot_compliant
ECCN codeEAR99
Other featuresHIGH SURGE CURRENT CAPABILITY
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance75 Ω
Maximum forward voltage (VF)1.2 V
JEDEC-95 codeDO-214AA
JESD-30 codeR-PDSO-C2
Maximum knee impedance760 Ω
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
polarityUNIDIRECTIONAL
Maximum power dissipation5 W
GuidelineAEC-Q101
Nominal reference voltage87 V
Maximum reverse current0.5 µA
Reverse test voltage66 V
surface mountYES
technologyZENER
Terminal formC BEND
Terminal locationDUAL
Working test current15 mA
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla
Street Chatsworth

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$ %    !"#
SMBJ5347BHE3
THRU
SMBJ5388BHE3
5 Watt
Surface Mount Silicon
Zener Diode
10
to
200
Volts
DO-214AA
(SMB) (Lead Frame)
H
Features
AEC-Q101 Qualified
Low Profile Package for Surface Mountiong(Flat Handling
Surface for Accurate Placement)
Zener Voltage
10V
to
200V
High Surge Current Capability
For Available Tolerances-see Note 1
Available on Tape and Reel (see E1A std RS-481)
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Halogen
free
Mechanical Data
Standard JEDEC Outlines as Shown
Marking: See page
2
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Maximum Temperature for Soldering: 260 for 10 Seconds
Forward Voltage at
1.0A Current
Steady State Power
Dissipation
Operating and Storage
Temperatures
Thermal Resistance
V
F
P
(AV)
T
J
, T
STG
R
R
JL
JA
J
Electrical Characteristics @ 25 C Unless Otherwise Specified
1.2Volts
E
A
C
5Watts See Note 2
-55
to +150
15
/W
90
/W
DIM
A
B
C
D
E
G
H
J
INCHES
MIN
.075
.077
.002
-----
.030
.200
.160
.130
MAX
.095
.083
.008
.02
.060
.220
.187
.155
D
B
G
DIMENSIONS
MM
MIN
1.91
1.96
.05
-----
.76
5.08
4.06
3.30
Note:
1.High Tempertaure Solder Exemptions Applied,see EU Directive Annex 7.
2. Lead temperature at 75 = TL at mounting plane. Derate linearly
above 75 to zero power at 150
3. Ambient temperature at 15 = TA at mounting plane. Derate linearly
above 15 to zero power at 150
MAX
2.41
2.10
.20
.51
1.52
5.59
4.75
3.94
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090"
0.085”
0.070”
Revision:
A
www.mccsemi.com
1 of
5
2015/06/05
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