EEWORLDEEWORLDEEWORLD

Part Number

Search

SZ3FA82SMSS

Description
Zener Diode, 82V V(Z), 10%, 4W, Silicon, Unidirectional, HERMETIC SEALED, GLASS, SMS, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size152KB,2 Pages
ManufacturerSSDI
Websitehttp://www.ssdi-power.com/
Download Datasheet Parametric View All

SZ3FA82SMSS Overview

Zener Diode, 82V V(Z), 10%, 4W, Silicon, Unidirectional, HERMETIC SEALED, GLASS, SMS, 2 PIN

SZ3FA82SMSS Parametric

Parameter NameAttribute value
MakerSSDI
package instructionE-LELF-R2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance120 Ω
JESD-30 codeE-LELF-R2
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-65 °C
Package body materialGLASS
Package shapeELLIPTICAL
Package formLONG FORM
polarityUNIDIRECTIONAL
Maximum power dissipation4 W
GuidelineMIL-19500
Nominal reference voltage82 V
Maximum reverse current1 µA
Reverse test voltage59 V
surface mountYES
technologyZENER
Terminal formWRAP AROUND
Terminal locationEND
Voltage temperatureCoeff-Max106.6 mV/°C
Maximum voltage tolerance10%
Working test current10 mA
Solid State Devices, Inc.
14701 Firestone Blvd * La Mirada, Ca 90638
Phone: (562) 404-4474 * Fax: (562) 404-1773
ssdi@ssdi-power.com *
www.ssdi-power.com
SZ3GA7.5 thru SZ3GB510
and
SZ3FA7.5 thru SZ3FB510
3.0 W and 4.0 W
7.5 – 510 VOLTS
ZENER DIODES
DESIGNER’S DATA SHEET
FEATURES:
Hermetically Sealed in Glass
Axial Lead rated at 3 W
Surface Mount rated at 4W
6/
Available Screening to TX, TXV, and Space Levels
Voltage Tolerances of 10% (A) and 5% (B) Available.
Contact factory for other Voltage Tolerances
Voltage Range from 7.5V to 510V. For Other Voltages,
Contact Factory.
Maximum Ratings
Nominal Zener Voltage
Maximum Zener Current
Forward Surge Current
(8.3 msec Pulse)
Continuous
Power
Axial
SM, SMS
Symbol
Value
Units
V
Z
I
ZM
I
FSM
P
D
Top
&Tstg
R
θJL
R
θJE
7.5 - 510
400 - 6
8-0.04
3.0
4.0
-65 to +175
65
32
V
mA
A
DIM
A
B
C
D
GLASS SLEEVE (G)
MIN.
MAX.
---
.085”
.130”
.175”
.028”
.034”
1.00”
---
5/
FRIT GLASS (F)
MIN.
MAX.
---
.145”
---
.175”
.028”
.034”
1.00”
---
AXIAL(___)
C
W
ºC
ºC/W
DIM
A
B
C
B
ØA
Operating and Storage
Temp.
Thermal Resistance,
Junction to Lead, Axial, L=3/8
Junction to End Cap, SM, SMS
Part Number/Ordering Information
7/
SZ3
__ __ __ __ __
Screening
6/
__
= Not Screened
TX = TX Level
TXV = TXV
S = S Level (for SM, use –S)
5/
Package Type
___
= Axial Leaded
SM
= Surface Mount Round Tab
SMS
= Surface Mount Square Tab
Voltage/Family
7.5
thru
510
= 7.5V thru 510V
(See Table 1)
Voltage Tolerance
A
= 10% Voltage Tolerance
B
= 5% Voltage
GLASS SLEEVE (G)
MIN
.077”
.130”
.010”
MAX
.083”
.146”
.022”
ROUND TAB (SM)
5/
All dimensions are prior to soldering
Device Shape
G
= Glass Sleeve (Cylindrical Shape)
F
= Frit Glass (Prolate Spheroid Shape)
SQUARE TAB (SMS)
5/
DIM
A
B
C
D
GLASS SLEEVE
(G)
MIN.
MAX.
.090”
.100”
.175”
.215”
.022”
.028”
---
.002”
FRIT GLASS
(F)
MIN.
MAX.
.145”
.155”
.200”
.220”
.022”
.028”
---
.002”
All dimensions are prior to soldering
NOTE:
All specifications are subject to change without notification.
SCD's for these devices should be reviewed by SSDI prior to release.
DATA SHEET #: Z00004M
DOC
About the M4's massive time to market
We are currently using TI's M3 series, which has been discontinued. The replacement M4 has not yet arrived, and I don't know what to do! Does anyone know the specific time of TI?...
JohnnyLi Microcontroller MCU
Urgently looking for practical programming of C51 counter
#include #define uchar unsigned char; #define uint unsigned int; uchar a[]={0xc0,0xf9,0xa4,0xb0,0x99, 0x92,0x82,0xf8,0x80,0x90}; uchar e,d,t; void chushihua() ; uint x,y,b; main() { chushihua(); while...
pengjin Embedded System
Help with GE PLC Series 6 and DC300 failure causes
Please tell me which expert is more familiar with GE PLC Series 6 and DC 300 drive control system. I have encountered a problem recently and it has not been completely solved. Fault phenomenon: Each d...
eeleader Industrial Control Electronics
Briefly explain the mainstream lithography technology
Briefly explain the mainstream lithography technology - lithography refers to the process of transferring the integrated circuit pattern from the mask to the silicon wafer. Lithography technology is o...
ruopu PCB Design
Talking about ucOS, why do we need an operating system?
1. The operating system can significantly reduce the difficulty of development. The operating system helps us coordinate the coupling relationship between multiple programs. For example, we need to di...
兰博 Embedded System
[RVB2601 Creative Application Development] Flower Watering Detector - Development Board Introduction
I planned to make a flower watering detector, using a single-chip microcomputer to read the signal of the soil moisture sensor in the flowerpot, and after ADC conversion, to judge the dryness and humi...
gsrnj XuanTie RISC-V Activity Zone

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2227  940  244  2845  2408  45  19  5  58  49 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号