EEWORLDEEWORLDEEWORLD

Part Number

Search

ISPLSI5512VA-110LQ208

Description
EE PLD, 10ns, 512-Cell, CMOS, PQFP208, PLASTIC, QFP-208
CategoryProgrammable logic devices    Programmable logic   
File Size278KB,28 Pages
ManufacturerLattice
Websitehttp://www.latticesemi.com
Download Datasheet Parametric Compare View All

ISPLSI5512VA-110LQ208 Overview

EE PLD, 10ns, 512-Cell, CMOS, PQFP208, PLASTIC, QFP-208

ISPLSI5512VA-110LQ208 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerLattice
Parts packaging codeQFP
package instructionPLASTIC, QFP-208
Contacts208
Reach Compliance Codecompliant
ECCN codeEAR99
Other features512 MACROCELLS
maximum clock frequency91 MHz
In-system programmableYES
JESD-30 codeS-PQFP-G208
JESD-609 codee0
JTAG BSTYES
length28 mm
Humidity sensitivity level3
Dedicated input times
Number of I/O lines144
Number of macro cells512
Number of terminals208
Maximum operating temperature70 °C
Minimum operating temperature
organize0 DEDICATED INPUTS, 144 I/O
Output functionMACROCELL
Package body materialPLASTIC/EPOXY
encapsulated codeHFQFP
Encapsulate equivalent codeQFP208,1.2SQ,20
Package shapeSQUARE
Package formFLATPACK, HEAT SINK/SLUG, FINE PITCH
Peak Reflow Temperature (Celsius)225
power supply2.5/3.3,3.3 V
Programmable logic typeEE PLD
propagation delay10 ns
Certification statusNot Qualified
Maximum seat height4.1 mm
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width28 mm
ispLSI 5512VA
®
In-System Programmable
3.3V SuperWIDE™ High Density PLD
Features
• SuperWIDE HIGH-DENSITY IN-SYSTEM
PROGRAMMABLE LOGIC
— 3.3V Power Supply
— User Selectable 3.3V/2.5V I/O
— 24000 PLD Gates / 512 Macrocells
— Up to 288 I/O Pins
— 512 Registers
— High-Speed Global Interconnect
— SuperWIDE 32 Generic Logic Block (GLB) Size for
Optimum Performance
— SuperWIDE Input Gating (68 Inputs) for Fast
Counters, State Machines, Address Decoders, etc.
— PCB Efficient Ball Grid Array (BGA) Package Options
— Interfaces with Standard 5V TTL Devices
• HIGH PERFORMANCE E
2
CMOS
®
TECHNOLOGY
f
max
= 110 MHz Maximum Operating Frequency
t
pd
= 8.5 ns Propagation Delay
— Enhanced
t
su2
= 7 ns,
t
su3 (CLK0/1)
= 4.5ns,
t
su3 (CLK2/3)
= 3.5ns
— TTL/3.3V/2.5V Compatible Input Thresholds and
Output Levels
— Electrically Erasable and Reprogrammable
— Non-Volatile
— Programmable Speed/Power Logic Path Optimization
• IN-SYSTEM PROGRAMMABLE
— Increased Manufacturing Yields, Reduced Time-to-
Market, and Improved Product Quality
— Reprogram Soldered Devices for Faster Debugging
• 100% IEEE 1149.1 BOUNDARY SCAN TESTABLE AND
3.3V IN-SYSTEM PROGRAMMABLE
• ARCHITECTURE FEATURES
— Enhanced Pin-Locking Architecture with Single-
Level Global Routing Pool and SuperWIDE GLBs
— Wrap Around Product Term Sharing Array Supports
up to 35 Product Terms Per Macrocell
— Macrocells Support Concurrent Combinatorial and
Registered Functions
— Macrocell Registers Feature Multiple Control
Options Including Set, Reset and Clock Enable
— Four Dedicated Clock Input Pins Plus Macrocell
Product Term Clocks
— Slew and Skew Programmable I/O (SASPI/O)
Supports Programmable Bus Hold, Pull-up, Open
Drain and Slew and Skew Rate Options
— Six Global Output Enable Terms, Two Global OE
Pins and One Product Term OE per Macrocell
Functional Block Diagram
Input Bus
Generic
Logic Block
Input Bus
Generic
Logic Block
Input Bus
Generic
Logic Block
Input Bus
Generic
Logic Block
Boundary
Scan
Interface
Generic
Logic Block
Generic
Logic Block
Input Bus
Input Bus
Generic
Logic Block
Generic
Logic Block
Input Bus
Input Bus
Generic
Logic Block
Global Routing Pool
(GRP)
Generic
Logic Block
Input Bus
Input Bus
Generic
Logic Block
Generic
Logic Block
Input Bus
Input Bus
Generic
Logic Block
Generic
Logic Block
Generic
Logic Block
Generic
Logic Block
Input Bus
Input Bus
Input Bus
Input Bus
ispLSI 5000V Description
The ispLSI 5000V Family of In-System Programmable
High Density Logic Devices is based on Generic Logic
Blocks (GLBs) of 32 registered macrocells and a single
Global Routing Pool (GRP) structure interconnecting the
GLBs.
Outputs from the GLBs drive the Global Routing Pool
(GRP) between the GLBs. Switching resources are pro-
vided to allow signals in the Global Routing Pool to drive
any or all the GLBs in the device. This mechanism allows
fast, efficient connections across the entire device.
Each GLB contains 32 macrocells and a fully populated,
programmable AND-array with 160 logic product terms
and five extra control product terms. The GLB has 68
inputs from the Global Routing Pool which are available
in both true and complement form for every product term.
The 160 product terms are grouped in 32 sets of five and
sent into a Product Term Sharing Array (PTSA) which
allows sharing up to a maximum of 35 product terms for
a single function. Alternatively, the PTSA can be by-
passed for functions of five product terms or less. The
Copyright © 2002 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
January 2002
5512va_08
1

ISPLSI5512VA-110LQ208 Related Products

ISPLSI5512VA-110LQ208 ISPLSI5512VA-70LB388I ISPLSI5512VA-110LB272
Description EE PLD, 10ns, 512-Cell, CMOS, PQFP208, PLASTIC, QFP-208 EE PLD, 19ns, 512-Cell, CMOS, PBGA388, BGA-388 EE PLD, 10ns, 512-Cell, CMOS, PBGA272, BGA-272
Is it Rohs certified? incompatible incompatible incompatible
Maker Lattice Lattice Lattice
Parts packaging code QFP BGA BGA
package instruction PLASTIC, QFP-208 BGA-388 BGA-272
Contacts 208 388 272
Reach Compliance Code compliant compliant unknown
ECCN code EAR99 EAR99 EAR99
Other features 512 MACROCELLS 512 MACROCELLS 512 MACROCELLS
maximum clock frequency 91 MHz 45 MHz 91 MHz
In-system programmable YES YES YES
JESD-30 code S-PQFP-G208 S-PBGA-B388 S-PBGA-B272
JTAG BST YES YES YES
length 28 mm 35 mm 27 mm
Humidity sensitivity level 3 3 3
Number of I/O lines 144 288 192
Number of macro cells 512 512 512
Number of terminals 208 388 272
Maximum operating temperature 70 °C 85 °C 70 °C
organize 0 DEDICATED INPUTS, 144 I/O 0 DEDICATED INPUTS, 288 I/O 0 DEDICATED INPUTS, 192 I/O
Output function MACROCELL MACROCELL MACROCELL
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HFQFP BGA BGA
Encapsulate equivalent code QFP208,1.2SQ,20 BGA388,26X26,50 BGA272,20X20,50
Package shape SQUARE SQUARE SQUARE
Package form FLATPACK, HEAT SINK/SLUG, FINE PITCH GRID ARRAY GRID ARRAY
power supply 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V
Programmable logic type EE PLD EE PLD EE PLD
propagation delay 10 ns 19 ns 10 ns
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 4.1 mm 3.25 mm 2.8 mm
Maximum supply voltage 3.6 V 3.6 V 3.6 V
Minimum supply voltage 3 V 3 V 3 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal form GULL WING BALL BALL
Terminal pitch 0.5 mm 1.27 mm 1.27 mm
Terminal location QUAD BOTTOM BOTTOM
width 28 mm 35 mm 27 mm
Is it lead-free? Contains lead Contains lead -
JESD-609 code e0 e0 -
Peak Reflow Temperature (Celsius) 225 225 -
Terminal surface Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb) -
Maximum time at peak reflow temperature 30 30 -
Recycling osn1500
Jiangmen Shengyi specializes in recycling osn1500, recycling osn1500 sub-racks, recycling osn1500 boards, and recycling osn1500 and other transmission equipment all year round across the country. We p...
shengyi666 Industrial Control Electronics
Audio PWM encoding problem
As the title says, the input signal of a Class D audio amplifier chip is required to be a PWM signal. How to encode the audio signal into PWM? What is the encoding rule? Here are two schematic diagram...
TDB Analog electronics
Help! As shown in the picture, a resistor and capacitor circuit is connected to the audio output of the power amplifier. Is this just a pull-down function?
As shown in the figure, a resistor and capacitor circuit is connected to the audio output of the power amplifier. Is this just a pull-down function? Are there other functions? Please explain, please g...
zhangjr Analog electronics
Current sampling
My thesis topic is the design of a light bulb optometry controller, which is to measure the current of the light bulb to determine whether the light bulb is good or bad. The current is about 10A and t...
shy117301 MCU
[Qinheng RISC-V core CH582] CH582 USB HOST code interpretation
[i=s]This post was last edited by pomin on 2022-4-3 14:24[/i]CH582 USB HOST Code Interpretation The feature of CH582 MCU is Bluetooth, so I plan to make a small device that can convert a wired keyboar...
pomin Domestic Chip Exchange
Conversion of wire harness diameter between American standard AWG and national standard "square"
Recently, I have a task at work that requires calculating the wire diameter of the wire harness and corresponding to the US standard AWG wire number. I would like to share the conversion method and us...
Arvinˇ Analog electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1812  134  1115  2081  2498  37  3  23  42  51 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号