HYS72V1000GU-12 datasheet, PDF

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HYS72V1000GU-12: DescriptionSynchronous DRAM Module, 1MX72, 10ns, CMOS, PDMA168; Categorystorage storage; File Size658KB，13 Pages; ManufacturerInfineon; Websitehttp://www.infineon.com/

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HYS72V1000GU-12 Overview

Synchronous DRAM Module, 1MX72, 10ns, CMOS, PDMA168

HYS72V1000GU-12 Parametric

Parameter Name	Attribute value
Maker	Infineon
package instruction	DIMM, DIMM168
Reach Compliance Code	unknown
Maximum access time	10 ns
Maximum clock frequency (fCLK)	83 MHz
I/O type	COMMON
JESD-30 code	R-PDMA-N168
memory density	75497472 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE
memory width	72
Number of terminals	168
word count	1048576 words
character code	1000000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX72
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIMM
Encapsulate equivalent code	DIMM168
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
Maximum standby current	0.01 A
Maximum slew rate	0.625 mA
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL

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HYS72V1000GU-12 Related Products

	HYS72V1000GU-12	HYS72V1000GU-10	HYS64V1000GU-12
Description	Synchronous DRAM Module, 1MX72, 10ns, CMOS, PDMA168	Synchronous DRAM Module, 1MX72, 8ns, CMOS, PDMA168	Synchronous DRAM Module, 1MX64, 10ns, CMOS, PDMA168
Maker	Infineon	Infineon	Infineon
package instruction	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168
Reach Compliance Code	unknown	unknown	unknown
Maximum access time	10 ns	8 ns	10 ns
Maximum clock frequency (fCLK)	83 MHz	100 MHz	83 MHz
I/O type	COMMON	COMMON	COMMON
JESD-30 code	R-PDMA-N168	R-PDMA-N168	R-PDMA-N168
memory density	75497472 bit	75497472 bit	67108864 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE
memory width	72	72	64
Number of terminals	168	168	168
word count	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000
Maximum operating temperature	70 °C	70 °C	70 °C
organize	1MX72	1MX72	1MX64
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIMM	DIMM	DIMM
Encapsulate equivalent code	DIMM168	DIMM168	DIMM168
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified
refresh cycle	4096	4096	4096
Maximum standby current	0.01 A	0.01 A	0.008 A
Maximum slew rate	0.625 mA	0.725 mA	0.5 mA
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL

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