Synchronous DRAM Module, 1MX64, 10ns, CMOS, PDMA168
| Parameter Name | Attribute value |
| Maker | Infineon |
| package instruction | DIMM, DIMM168 |
| Reach Compliance Code | unknown |
| Maximum access time | 10 ns |
| Maximum clock frequency (fCLK) | 83 MHz |
| I/O type | COMMON |
| JESD-30 code | R-PDMA-N168 |
| memory density | 67108864 bit |
| Memory IC Type | SYNCHRONOUS DRAM MODULE |
| memory width | 64 |
| Number of terminals | 168 |
| word count | 1048576 words |
| character code | 1000000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1MX64 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIMM |
| Encapsulate equivalent code | DIMM168 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| refresh cycle | 4096 |
| Maximum standby current | 0.008 A |
| Maximum slew rate | 0.5 mA |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| HYS64V1000GU-12 | HYS72V1000GU-10 | HYS72V1000GU-12 | |
|---|---|---|---|
| Description | Synchronous DRAM Module, 1MX64, 10ns, CMOS, PDMA168 | Synchronous DRAM Module, 1MX72, 8ns, CMOS, PDMA168 | Synchronous DRAM Module, 1MX72, 10ns, CMOS, PDMA168 |
| Maker | Infineon | Infineon | Infineon |
| package instruction | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 |
| Reach Compliance Code | unknown | unknown | unknown |
| Maximum access time | 10 ns | 8 ns | 10 ns |
| Maximum clock frequency (fCLK) | 83 MHz | 100 MHz | 83 MHz |
| I/O type | COMMON | COMMON | COMMON |
| JESD-30 code | R-PDMA-N168 | R-PDMA-N168 | R-PDMA-N168 |
| memory density | 67108864 bit | 75497472 bit | 75497472 bit |
| Memory IC Type | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
| memory width | 64 | 72 | 72 |
| Number of terminals | 168 | 168 | 168 |
| word count | 1048576 words | 1048576 words | 1048576 words |
| character code | 1000000 | 1000000 | 1000000 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| organize | 1MX64 | 1MX72 | 1MX72 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIMM | DIMM | DIMM |
| Encapsulate equivalent code | DIMM168 | DIMM168 | DIMM168 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| power supply | 3.3 V | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 4096 | 4096 | 4096 |
| Maximum standby current | 0.008 A | 0.01 A | 0.01 A |
| Maximum slew rate | 0.5 mA | 0.725 mA | 0.625 mA |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V |
| surface mount | NO | NO | NO |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | NO LEAD | NO LEAD | NO LEAD |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL |
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