5962R0623201QXC datasheet, PDF

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5962R0623201QXC: DescriptionSupport Circuit, CDFP28, CERAMIC, DFP-28; CategoryWireless rf/communication Telecom circuit; File Size194KB，24 Pages; ManufacturerCobham PLC

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5962R0623201QXC Overview

Support Circuit, CDFP28, CERAMIC, DFP-28

5962R0623201QXC Parametric

Parameter Name	Attribute value
Maker	Cobham PLC
package instruction	DFP, FL28,.4,25
Reach Compliance Code	unknown
JESD-30 code	S-CDFP-F28
JESD-609 code	e4
length	9.652 mm
Number of functions	1
Number of terminals	28
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP
Encapsulate equivalent code	FL28,.4,25
Package shape	SQUARE
Package form	FLATPACK
power supply	3.3 V
Certification status	Qualified
Filter level	MIL-PRF-38535 Class Q
Maximum seat height	2.921 mm
Maximum slew rate	0.12 mA
Nominal supply voltage	3.3 V
surface mount	YES
Telecom integrated circuit types	SUPPORT CIRCUIT
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	FLAT
Terminal pitch	0.635 mm
Terminal location	DUAL
total dose	100k Rad(Si) V
width	9.652 mm

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REVISIONS

LTR

DESCRIPTION

DATE (YR-MO-DA)

APPROVED

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Charles F. Saffle

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

CHECKED BY

Charles F. Saffle

APPROVED BY

Thomas M. Hess

DRAWING APPROVAL DATE

06-07-06

REVISION LEVEL

SIZE

SHEET

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

MICROCIRCUIT, DIGITAL, RADIATION

HARDENED, SPACEWIRE PHYSICAL LAYER

TRANSCEIVER, MONOLITHIC SILICON

CAGE CODE

67268

1 OF

5962-06232

DSCC FORM 2233

APR 97

5962-E499-06

1.3 Absolute maximum ratings.

Supply voltage range (V

)........................................................................................................ -0.3 V dc to 4.0 V dc

Voltage on any pin during operation (V

I/O

) ................................................................................. -0.3 V dc to (V

+ 0.3 V)

Voltage on any pin during cold spare (V

I/O

)................................................................................ -0.3 V dc to 4.0 V dc

DC input current (I

) ...................................................................................................................

±10

Maximum power dissipation (P

) ............................................................................................... 120 mW

Thermal resistance, junction-to-case (θ

)................................................................................. 10°C/W

Storage temperature range (T

STG

) ............................................................................................. -65°C to +150°C

1.4 Recommended operating conditions.

Supply voltage range (V

)........................................................................................................ 3.0 V dc to 3.6 V dc

DC input voltage range (V

)...................................................................................................... 0 V dc to V

1.5 Radiation features.

Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) ...............................................

100 krads(Si)

Single event latchup (SEL) ........................................................................................................

110 MeV-cm /mg

Single event upset (SEU) saturated cross-section (σ

sat

)............................................................ 2.9E-8 cm /device

Onset single event upset (SEU) linear energy threshold (LET), no upset.................................. 38 MeV-cm

/mg

Neutron fluence ......................................................................................................................... 1 x 10

neutrons/cm

Dose rate upset ......................................................................................................................... 3/

Dose rate survivability................................................................................................................ 3/

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 -

MIL-STD-1835 -

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Copies of these documents are available online at

http://assist.daps.dla.mil/quicksearch/

http://assist.daps.dla.mil

or from

the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of

this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

__________

Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the

maximum levels may degrade performance and affect reliability.

Guaranteed, but not tested.

When characterized as a result of procuring activities request, the condition will be specified.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-06232

SHEET

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein and figure 1.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.

3.2.3 Truth table. The truth table shall be as specified on figure 3.

3.2.4 Functional block diagram. The functional block diagram shall be as specified on figure 4.

3.2.5 Timing waveforms and test circuit. The timing waveforms and test circuit shall be as specified on figures 5 through 12.

3.2.6 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document

revision level control and shall be made available to the preparing and acquiring activity upon request.

3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the full

case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical

tests for each subgroup are defined in table IA.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be

marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer

has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be

marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be

in accordance with MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in

MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.

3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535

listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of

compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see

6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this

drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and

herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.

3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for

device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.

3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2

herein) involving devices acquired to this drawing is required for any change that affects this drawing.

3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the

option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made

available onshore at the option of the reviewer.

3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in

microcircuit group number 77 (see MIL-PRF-38535, appendix A).

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-06232

SHEET

5962R0623201QXC Related Products

	5962R0623201QXC	5962R0623201QXA	5962R0623202VXC	5962R0623202QXC	5962R0623201VXA	5962R0623201VXC	5962R0623202QXA	5962R0623202VXA
Description	Support Circuit, CDFP28, CERAMIC, DFP-28	Support Circuit, CDFP28, CERAMIC, DFP-28	Support Circuit, CDFP28, CERAMIC, DFP-28	Support Circuit, CDFP28, CERAMIC, DFP-28	Support Circuit, CDFP28, CERAMIC, DFP-28	Support Circuit, CDFP28, CERAMIC, DFP-28	Support Circuit, CDFP28, CERAMIC, DFP-28	Support Circuit, CDFP28, CERAMIC, DFP-28
Maker	Cobham PLC	Cobham PLC	Cobham PLC	Cobham PLC	Cobham PLC	Cobham PLC	Cobham PLC	Cobham PLC
package instruction	DFP, FL28,.4,25	DFP, FL28,.4,25	DFP, FL28,.4,25	DFP, FL28,.4,25	DFP, FL28,.4,25	DFP, FL28,.4,25	DFP, FL28,.4,25	DFP, FL28,.4,25
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	S-CDFP-F28	S-CDFP-F28	S-CDFP-F28	S-CDFP-F28	S-CDFP-F28	S-CDFP-F28	S-CDFP-F28	S-CDFP-F28
JESD-609 code	e4	e0	e4	e4	e0	e4	e0	e0
length	9.652 mm	9.652 mm	9.652 mm	9.652 mm	9.652 mm	9.652 mm	9.652 mm	9.652 mm
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28	28	28
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-40 °C	-40 °C	-55 °C	-55 °C	-40 °C	-40 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP	DFP	DFP	DFP	DFP	DFP	DFP	DFP
Encapsulate equivalent code	FL28,.4,25	FL28,.4,25	FL28,.4,25	FL28,.4,25	FL28,.4,25	FL28,.4,25	FL28,.4,25	FL28,.4,25
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Qualified	Qualified	Qualified	Qualified	Qualified	Qualified	Qualified	Qualified
Filter level	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class V	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class V	MIL-PRF-38535 Class V	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class V
Maximum seat height	2.921 mm	2.921 mm	2.921 mm	2.921 mm	2.921 mm	2.921 mm	2.921 mm	2.921 mm
Maximum slew rate	0.12 mA	0.12 mA	0.12 mA	0.12 mA	0.12 mA	0.12 mA	0.12 mA	0.12 mA
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
Telecom integrated circuit types	SUPPORT CIRCUIT	SUPPORT CIRCUIT	SUPPORT CIRCUIT	SUPPORT CIRCUIT	SUPPORT CIRCUIT	SUPPORT CIRCUIT	SUPPORT CIRCUIT	SUPPORT CIRCUIT
Temperature level	MILITARY	MILITARY	AUTOMOTIVE	AUTOMOTIVE	MILITARY	MILITARY	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	GOLD	TIN LEAD	GOLD	GOLD	TIN LEAD	GOLD	TIN LEAD	TIN LEAD
Terminal form	FLAT	FLAT	FLAT	FLAT	FLAT	FLAT	FLAT	FLAT
Terminal pitch	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
total dose	100k Rad(Si) V	100k Rad(Si) V	100k Rad(Si) V	100k Rad(Si) V	100k Rad(Si) V	100k Rad(Si) V	100k Rad(Si) V	100k Rad(Si) V
width	9.652 mm	9.652 mm	9.652 mm	9.652 mm	9.652 mm	9.652 mm	9.652 mm	9.652 mm

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