MT46V16M16FG-5BL:G datasheet, PDF

Datasheet> All Categories > storage> MT46V16M16FG-5BL:G

MT46V16M16FG-5BL:G: Description16M X 16 DDR DRAM, 0.7 ns, PDSO66; Categorystorage; File Size3MB，93 Pages; ManufacturerMicron; Websitehttp://www.micron.com/

Download Datasheet Parametric View All

MT46V16M16FG-5BL:G Overview

16M X 16 DDR DRAM, 0.7 ns, PDSO66

MT46V16M16FG-5BL:G Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	66
Maximum operating temperature	70 Cel
Minimum operating temperature	0.0 Cel
Maximum supply/operating voltage	2.7 V
Minimum supply/operating voltage	2.5 V
Rated supply voltage	2.6 V
Minimum access time	0.7000 ns
Processing package description	0.40 INCH, lead FREE, plastic, TSOP-66
Lead-free	Yes
EU RoHS regulations	Yes
state	DISCONTINUED
Craftsmanship	CMOS
packaging shape	Rectangle
Package Size	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	0.6500 mm
terminal coating	MATTE Tin
Terminal location	pair
Packaging Materials	Plastic/Epoxy
Temperature level	COMMERCIAL
memory width	16
organize	16M × 16
storage density	2.68E8 deg
operating mode	Synchronize
Number of digits	1.68E7 words
Number of digits	16M
Access method	Four BANK PAGE BURST
Memory IC type	double rate synchronous dynamic random access memory dynamic random access memory
Number of ports	1

Preview

Download Datasheet

View All

256Mb: x4, x8, x16 DDR SDRAM

Features

Double Data Rate (DDR) SDRAM

MT46V64M4 – 16 Meg x 4 x 4 banks

MT46V32M8 – 8 Meg x 8 x 4 banks

MT46V16M16 – 4 Meg x 16 x 4 banks

Features

• V

= +2.5V ±0.2V, V

Q = +2.5V ±0.2V

• V

= +2.6V ±0.1V, V

Q = +2.6V ±0.1V (DDR400)

• Bidirectional data strobe (DQS) transmitted/

received with data, that is, source-synchronous data

capture (x16 has two – one per byte)

• Internal, pipelined double-data-rate (DDR)

architecture; two data accesses per clock cycle

• Differential clock inputs (CK and CK#)

• Commands entered on each positive CK edge

• DQS edge-aligned with data for READs; center-

aligned with data for WRITEs

• DLL to align DQ and DQS transitions with CK

• Four internal banks for concurrent operation

• Data mask (DM) for masking write data

(x16 has two – one per byte)

• Programmable burst lengths (BL): 2, 4, or 8

• Auto refresh

–

64ms, 8192-cycle(Commercial & Industrial)

–

16ms, 8192-cycle (Automotive)

• Self refresh (not available on AT devices)

• Longer-lead TSOP for improved reliability (OCPL)

• 2.5V I/O (SSTL_2-compatible)

• Concurrent auto precharge option supported

•

RAS lockout supported (

RAP =

RCD)

Options

Marking

• Configuration

–

64 Meg x 4 (16 Meg x 4 x 4 banks)

64M4

–

32 Meg x 8 (8 Meg x 8 x 4 banks)

32M8

–

16 Meg x 16 (4 Meg x 16 x 4 banks)

16M16

• Plastic package – OCPL

–

66-pin TSOP

–

66-pin TSOP (Pb-free)

• Plastic package

–

60-ball FBGA (8mm x 14mm)

–

60-ball FBGA (8mm x 14mm) (Pb-free)

–

60-ball FBGA (8mm x 12.5mm)

–

60-ball FBGA (8mm x 12.5mm)

(Pb-free)

• Timing – cycle time

–

5ns @ CL = 3 (DDR400B)

-5B

–

6ns @ CL = 2.5 (DDR333) FBGA only

-6

–

6ns @ CL = 2.5 (DDR333) TSOP only

-6T

-75E

–

7.5ns @ CL = 2 (DDR266)

-75Z

–

7.5ns @ CL = 2 (DDR266A)

-75

–

7.5ns @ CL = 2.5 (DDR266B)

• Self refresh

–

Standard

None

–

Low-power self refresh

• Temperature rating

–

Commercial (0°C to +70°C)

None

–

Industrial (–40°C to +85°C)

–

Automotive (–40°C to +105°C)

• Revision

–

x4, x8

–

x16

–

x4, x8, x16

Notes: 1. Only available on Revision F and G.

2. Only available on Revision K.

3. Not recommended for new designs.

4. Contact Micron for availability.

PDF: 09005aef80768abb/Source: 09005aef82a95a3a

256Mb_DDR_x4x8x16_D1.fm - 256Mb DDR: Rev. O, Core DDR: Rev. B 1/09 EN

Micron Technology, Inc., reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

256Mb: x4, x8, x16 DDR SDRAM

Table of Contents

State Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

General Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

Automotive Tempature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

Functional Block Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

Pin and Ball Assignments and Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Electrical Specifications – DC and AC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45

DESELECT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49

NO OPERATION (NOP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49

LOAD MODE REGISTER (LMR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49

ACTIVE (ACT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50

READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51

WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52

PRECHARGE (PRE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53

BURST TERMINATE (BST) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53

AUTO REFRESH (AR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53

SELF REFRESH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53

Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54

INITIALIZATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54

REGISTER DEFINITION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57

ACTIVE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61

READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62

WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74

PRECHARGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87

AUTO REFRESH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .89

SELF REFRESH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .90

Power-down (CKE Not Active) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .92

PDF: 09005aef80768abb/Source: 09005aef82a95a3a

256Mb_DDRTOC.fm - 256Mb DDR: Rev. O, Core DDR: Rev. B 1/09 EN

Micron Technology, Inc., reserves the right to change products or specifications without notice.

Recommended Resources

Infrared remote control dimming circuit b

Several improved sawtooth wave generator circuits-bootstrap circuit

TA2022 and TAS5010 digital power amplifier circuit diagram

STK4132II audio IC circuit diagram

Battery powered warning light

Practical circuit of full-bridge switching regulated power supply

Pre-match training FAQ: Detailed explanation of ON Semiconductor's ultra-low power RSL10 Bluetooth SoC development board: [Live Details] Detailed Explanation of ON Semiconductor's Ultra-Low Power RSL10 Bluetooth SoC Development Board[Content Introduction] ON Semiconductor, Avnet and EEWorld have jointly provided the indu...; EEWORLD社区 onsemi and Avnet IoT Innovation Design Competition

How to start with PCB layout and wiring to avoid noise caused by improper switching power supply layout: [i=s]This post was last edited by qwqwqw2088 on 2021-9-29 10:17[/i]Share Analog Devices: How to start with PCB layout and routing to avoid noise caused by improper switching power supply layout"Noise ...; qwqwqw2088 PCB Design

Urgent! arm920T operating frequency problem: arm920T naked running software control hardware. In ADS, I wrote a while loop while (1) {a++} in the main function. I calculated the time and found that a can only increase to 6000000 in 10 seconds, t...; cyjszone ARM Technology

A well-known communication company in Beijing is recruiting DSP software engineers: DSP Software Engineer Annual Salary 16-19W Job Responsibilities: 1. Responsible for the verification and implementation of the physical layer algorithm of the wireless system products of the broadband...; e1065037772 Recruitment

Answer questions and get free samples: ON Semiconductor launches ultra-low power Bluetooth chip RSL10: [b][size=4]Event Details>>[/size][/b][url=https://www.eeworld.com.cn/huodong/psonsemi_rsl10_201809/][size=4][color=#0000ff][b]ON Semiconductor Launches Ultra-Low Power Bluetooth Chip RSL10 — Watch the...; EEWORLD社区 MCU

Telephone related technical information: Is there any telephone-related technical information available for download in the forum? If so, please provide it below. Thank you!...; caosiheng Analog electronics

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components