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MT58LC64K18M1EJ-12P

Description
Standard SRAM, 64KX18, 12ns, CMOS, PQCC52, 19.10 X 19.10 MM, PLASTIC, LCC-52
Categorystorage    storage   
File Size547KB,15 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Download Datasheet Parametric View All

MT58LC64K18M1EJ-12P Overview

Standard SRAM, 64KX18, 12ns, CMOS, PQCC52, 19.10 X 19.10 MM, PLASTIC, LCC-52

MT58LC64K18M1EJ-12P Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicron Technology
Parts packaging codeLCC
package instruction19.10 X 19.10 MM, PLASTIC, LCC-52
Contacts52
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time12 ns
Other featuresLINEAR BURST
I/O typeCOMMON
JESD-30 codeS-PQCC-J52
JESD-609 codee0
length19.1262 mm
memory density1179648 bit
Memory IC TypeSTANDARD SRAM
memory width18
Number of functions1
Number of ports1
Number of terminals52
word count65536 words
character code64000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX18
Output characteristics3-STATE
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC52,.8SQ
Package shapeSQUARE
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum seat height4.57 mm
Maximum standby current0.002 A
Minimum standby current3.14 V
Maximum slew rate0.2 mA
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width19.1262 mm

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