S54S260F/883B datasheet, PDF - EEWORLD Datasheet

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S54S260F/883B: DescriptionNOR Gate, TTL, CDIP14; Categorylogic logic; File Size140KB，3 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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S54S260F/883B Overview

NOR Gate, TTL, CDIP14

S54S260F/883B Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DIP, DIP14,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T14
JESD-609 code	e0
Logic integrated circuit type	NOR GATE
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Schmitt trigger	NO
Filter level	MIL-STD-883 Class B (Modified)
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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S54S260F/883B Related Products

	S54S260F/883B	S54LS260W/883B	S54LS260F/883C	S54LS260F/883B	N74LS260N	N74S260D-T	N74LS260A	N74S260N-B
Description	NOR Gate, TTL, CDIP14	NOR Gate, TTL, CDFP14	NOR Gate, TTL, CDIP14	NOR Gate, TTL, CDIP14	NOR Gate, TTL, PDIP14	NOR Gate, TTL, PDSO14	NOR Gate, TTL, PDIP14	NOR Gate, TTL, PDIP14,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP14,.3	DFP, FL14,.3	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	SOP, SOP14,.25	DIP, DIP14,.3	DIP, DIP14,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T14	R-XDFP-F14	R-XDIP-T14	R-XDIP-T14	R-PDIP-T14	R-PDSO-G14	R-PDIP-T14	R-PDIP-T14
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
Logic integrated circuit type	NOR GATE	NOR GATE	NOR GATE	NOR GATE	NOR GATE	NOR GATE	NOR GATE	NOR GATE
Number of terminals	14	14	14	14	14	14	14	14
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	70 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DFP	DIP	DIP	DIP	SOP	DIP	DIP
Encapsulate equivalent code	DIP14,.3	FL14,.3	DIP14,.3	DIP14,.3	DIP14,.3	SOP14,.25	DIP14,.3	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	FLATPACK	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Schmitt trigger	NO	NO	NO	NO	NO	NO	NO	NO
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	NO	NO	YES	NO	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	FLAT	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	-	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Base Number Matches	-	1	1	1	1	1	-	-

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