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S54LS260F/883B

Description
NOR Gate, TTL, CDIP14
Categorylogic    logic   
File Size140KB,3 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

S54LS260F/883B Overview

NOR Gate, TTL, CDIP14

S54LS260F/883B Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionDIP, DIP14,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T14
JESD-609 codee0
Logic integrated circuit typeNOR GATE
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Schmitt triggerNO
Filter levelMIL-STD-883 Class B (Modified)
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

S54LS260F/883B Related Products

S54LS260F/883B S54LS260W/883B S54LS260F/883C N74LS260N N74S260D-T N74LS260A N74S260N-B S54S260F/883B
Description NOR Gate, TTL, CDIP14 NOR Gate, TTL, CDFP14 NOR Gate, TTL, CDIP14 NOR Gate, TTL, PDIP14 NOR Gate, TTL, PDSO14 NOR Gate, TTL, PDIP14 NOR Gate, TTL, PDIP14, NOR Gate, TTL, CDIP14
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP14,.3 DFP, FL14,.3 DIP, DIP14,.3 DIP, DIP14,.3 SOP, SOP14,.25 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
JESD-30 code R-XDIP-T14 R-XDFP-F14 R-XDIP-T14 R-PDIP-T14 R-PDSO-G14 R-PDIP-T14 R-PDIP-T14 R-XDIP-T14
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
Logic integrated circuit type NOR GATE NOR GATE NOR GATE NOR GATE NOR GATE NOR GATE NOR GATE NOR GATE
Number of terminals 14 14 14 14 14 14 14 14
Maximum operating temperature 125 °C 125 °C 125 °C 70 °C 70 °C 70 °C 70 °C 125 °C
Package body material CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC
encapsulated code DIP DFP DIP DIP SOP DIP DIP DIP
Encapsulate equivalent code DIP14,.3 FL14,.3 DIP14,.3 DIP14,.3 SOP14,.25 DIP14,.3 DIP14,.3 DIP14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE FLATPACK IN-LINE IN-LINE SMALL OUTLINE IN-LINE IN-LINE IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Schmitt trigger NO NO NO NO NO NO NO NO
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES NO NO YES NO NO NO
technology TTL TTL TTL TTL TTL TTL TTL TTL
Temperature level MILITARY MILITARY MILITARY COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE FLAT THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) - Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified
Base Number Matches 1 1 1 1 1 - - -
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