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DSM2180F3-15T6

Description
DSM (Digital Signal Processor System Memory) for analog devices ADSP-218X family (5 V supply)
Categorystorage    storage   
File Size805KB,63 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Environmental Compliance
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DSM2180F3-15T6 Overview

DSM (Digital Signal Processor System Memory) for analog devices ADSP-218X family (5 V supply)

DSM2180F3-15T6 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSTMicroelectronics
Parts packaging codeQFP
package instructionPLASTIC, QFP-52
Contacts52
Reach Compliance Codecompli
JESD-30 codeS-PQFP-G52
JESD-609 codee4
length10 mm
memory density1048576 bi
Memory IC TypeMEMORY CIRCUIT
memory width8
Number of functions1
Number of terminals52
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX8
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height2.35 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width10 mm
DSM2180F3
DSM (Digital Signal Processor System Memory)
For Analog Devices ADSP-218X Family (5V Supply)
FEATURES SUMMARY
s
Glueless Connection to DSP
– Easily add memory, logic, and I/O to DSP
s
Figure 1. Packages
128K Byte Flash Memory
– For Bootloading and/or Data Overlay Memory
– Programmable Decoding and Paging Logic
allows accessing Flash memory as Byte DMA
(BDMA) and as External Data Overlay mem-
ory
– Rapidly access Flash memory with BDMA for
booting and loading internal DSP Overlay
memory. Alternatively access the same Flash
memory as External Data Overlay memory to
efficiently write Flash memory with code up-
dates and data, a byte at a time with no DMA
setup overhead
– Individual 16K Byte Flash memory sectors
match size of DSP External Data Overlay
window for efficient data management. Inte-
grated page logic provides easy DSP access
to all 128K Bytes.
– DSM connects to lower byte of 16-bit DSP
data bus. Byte-wide accesses to 8-bit BDMA
space. Half-word accesses to 16-bit Data
Memory Overlay and 16-bit I/O Mem space.
s
PQFP52 (T)
PLCC52 (K)
In-System Programming (ISP) with JTAG
– Program entire chip in 10-20 seconds with no
involvement of the DSP
– Eliminate sockets for pre-programmed mem-
ory and logic devices
– Efficient manufacturing allows easy product
testing and Just-In-Time inventory
– Use low-cost FlashLINK
TM
cable with PC
s
s
5V Devices (±10%)
Up to 16 Multifunction I/O Pins
– Increase total DSP system I/O capability
– I/O controlled by DSP software or PLD logic
– 8mA I/O pin drive at 5 Vcc
s
Content Security
– Programmable Security Bit blocks access of
device programmers and readers
s
General purpose PLD
– Over 3,000 Gates of PLD with 16 macro cells
– Use for peripheral glue logic to keypads, con-
trol panel, displays, LCD, UART devices, etc.
– Eliminate PLDs and external logic devices
– Create state machines, chip selects, simple
shifters and counters, clock dividers, delays
– Simple PSDsoft Express
TM
software ...Free
s
Zero-Power Technology
– 75
µA
standby at V
CC
=5V
Small Packaging
– 52-pin PQFP or 52-pin PLCC
Memory Speed
– 90 ns
1/63
s
s
December 2001

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Is it Rohs certified? conform to - conform to conform to conform to -
Maker STMicroelectronics - STMicroelectronics STMicroelectronics STMicroelectronics -
Parts packaging code QFP - LCC LCC QFP -
package instruction PLASTIC, QFP-52 - PLASTIC, LCC-52 PLASTIC, LCC-52 PLASTIC, QFP-52 -
Contacts 52 - 52 52 52 -
Reach Compliance Code compli - compli compli compli -
JESD-30 code S-PQFP-G52 - S-PQCC-J52 S-PQCC-J52 S-PQFP-G52 -
JESD-609 code e4 - e3 e3 e4 -
length 10 mm - 19.1262 mm 19.1262 mm 10 mm -
memory density 1048576 bi - 1048576 bi 1048576 bi 1048576 bi -
Memory IC Type MEMORY CIRCUIT - MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT -
memory width 8 - 8 8 8 -
Number of functions 1 - 1 1 1 -
Number of terminals 52 - 52 52 52 -
word count 131072 words - 131072 words 131072 words 131072 words -
character code 128000 - 128000 128000 128000 -
Operating mode ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS -
Maximum operating temperature 85 °C - 85 °C 85 °C 85 °C -
Minimum operating temperature -40 °C - -40 °C -40 °C -40 °C -
organize 128KX8 - 128KX8 128KX8 128KX8 -
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code QFP - QCCJ QCCJ QFP -
Package shape SQUARE - SQUARE SQUARE SQUARE -
Package form FLATPACK - CHIP CARRIER CHIP CARRIER FLATPACK -
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified -
Maximum seat height 2.35 mm - 4.57 mm 4.57 mm 2.35 mm -
Maximum supply voltage (Vsup) 5.5 V - 5.5 V 3.6 V 3.6 V -
Minimum supply voltage (Vsup) 4.5 V - 4.5 V 3 V 3 V -
Nominal supply voltage (Vsup) 5 V - 5 V 3.3 V 3.3 V -
surface mount YES - YES YES YES -
technology CMOS - CMOS CMOS CMOS -
Temperature level INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL -
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) - Matte Tin (Sn) Matte Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au) -
Terminal form GULL WING - J BEND J BEND GULL WING -
Terminal pitch 0.65 mm - 1.27 mm 1.27 mm 0.65 mm -
Terminal location QUAD - QUAD QUAD QUAD -
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
width 10 mm - 19.1262 mm 19.1262 mm 10 mm -
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