CM1423
Secure Digital (SD) Card
EMI Filter Array with ESD
Protection
Product Description
The CM1423 is an EMI filter array with ESD protection, which
integrates six Pi− filters (C−R−C) and four channels of ESD
protection. The CM1423’s filters have component values of
12 pF
−
100
W
−
12 pF. The part includes ESD protection diodes on
every pin, which provide a very high level of protection for sensitive
electronic components that may be subjected to electrostatic discharge
(ESD). All the ESD diodes safely dissipate ESD strikes of
±15
kV,
beyond the maximum requirement of the IEC 61000−4−2 international
standard. Using the MIL−STD−883 (Method 3015) specification for
Human Body Model (HBM) ESD, the pins are protected for contact
discharges at greater than
±30
kV.
This device is particularly well−suited for portable electronics
(e.g. mobile handsets, PDAs, notebook computers) because of its
small package and easy−to−use pin assignments. In particular,
the CM1423 is ideal for EMI filtering and protecting data lines from
ESD for the Secure Digital (SD) Card interface slot in mobile
handsets. The CM1423 is an all−inclusive solution for the SD card
interface since its EMI filters provide the proper cut−off frequency to
attenuate unwanted signals.
The CM1423 is manufactured in a space−saving, low−profile,
chip−scale package, and is optionally available with
OptiGuardt
coating for improved reliability. It is available with RoHS compliant
lead−free finishing.
Features
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WLCSP20
CP SUFFIX
CASE 567BZ
MARKING DIAGRAM
N231
N233
N231
N233
= CM1423−01CP
= CM1423−03CP
ORDERING INFORMATION
Device
CM1423−01CP
CM1423−03CP
Package
CSP−20
(Pb−Free)
CSP−20
(Pb−Free)
Shipping
†
3500/Tape & Reel
3500/Tape & Reel
•
Provides EMI Filtering and ESD Protection for an SD Port on
•
•
•
•
•
•
•
a Mobile Device
Six Channels of EMI Filtering with ESD Protection
Four Channels of ESD Protection
±15
kV ESD Protection on All I/O Pins
(IEC 61000−4−2, Contact Discharge)
±30
kV ESD Protection (HBM)
Better than 25 dB of Attenuation at 1 GHz for
12 pF
−
100
W
−
12 pF Filter Configuration
Integrates 34 Components Into Mall form Factor CSP
Solution
20−Bump, 4.000 mm X 1.458 mm Footprint Chip Scale
Package
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
•
Chip Scale Package Features Extremely Low Lead
Inductance for Optimum Filter and ESD Performance
•
Available with
OptiGuardt
Coating for Improved
Reliability at Assembly
•
These Devices are Pb−Free and are RoHS Compliant
Applications
•
Secure Digital (SD) Card Data Lines in Mobile
Handsets
•
SD Card Interface Protection for Other Mobile
Electronics such as MP3 Players, PDAs and Digital
Cameras
©
Semiconductor Components Industries, LLC, 2011
•
I/O Port Protection for Mobile Handsets, Notebook
Computers, PDAs, etc.
•
EMI Filtering for Data Ports in Cell Phones, PDAs or
Notebook Computers
March, 2011
−
Rev. 4
1
Publication Order Number:
CM1423/D
CM1423
Table 1. PIN DESCRIPTIONS
Pin(s)
A1
A2
A3
A4
A5
A6
A7
A8
B1−B4
Name
DAT2
DAT3
CMD
VSS1
CLK
ESD
DAT0
DAT1
GND
Description
DATA2 Filter + ESD Channel, System Side
DATA3 Filter + ESD Channel, System Side
CMD Signal Filter + ESD Channel, System Side
ESD
−
only Channel, Supply Voltage Ground
Clock Filter + ESD Channel
ESD
−
only Channel
DATA0 Filter + ESD Channel, System Side
DATA1 Filter + ESD Channel, System Side
Device Ground
Pin(s)
C1
C2
C3
C4
C5
C6
C7
C8
Name
DAT2
DAT3
CMD
VDD
CLK
VSS2
DAT0
DAT1
Description
DATA2 Filter + ESD Channel, SD Card Side
DATA3 Filter + ESD Channel, SD Card Side
CMD Signal Filter + ESD Channel, SD Card Side
ESD
−
only Channel, Supply Voltage
Clock Filter + ESD Channel
ESD
−
only Channel, Supply Voltage Ground
DATA0 Filter + ESD Channel, SD Card Side
DATA1 Filter + ESD Channel, SD Card Side
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Storage Temperature Range
DC Power per Resistor
DC Package Power Rating
Rating
−65
to +150
100
500
Units
°C
mW
mW
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
–40 to +85
Units
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS
(Note 1)
Symbol
R
C
V
DIODE
I
LEAK
V
SIG
Resistance
Capacitance
Diode Stand−off Voltage
Diode Leakage Current (Reverse Bias)
Signal Voltage
Positive Clamp
Negative Clamp
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2 Level 4
Dynamic Resistance
Positive
Negative
Cut−off Frequency, Z
SOURCE
= 50
W,
Z
LOAD
= 50
W
R = 100
W,
C = 12 pF
At 2.5 V DC, 1 MHz, 30 mV AC
I
DIODE
= 10
mA
V
DIODE
= 3.3 V
I
LOAD
= 10 mA
I
LOAD
=
−10
mA
(Note 2)
5.6
−1.5
±30
±15
1.6
0.4
145
Parameter
Conditions
Min
80
9
Typ
100
12
6.0
100
6.8
−0.8
300
9.0
−0.4
Max
120
15
Units
W
pF
V
nA
V
V
ESD
kV
R
DYN
W
f
C
MHz
1. T
A
= 25°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
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Analog electronics
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