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HB56UW865DB-6AU

Description
EDO DRAM Module, 8MX64, 60ns, CMOS, SODIMM-144
Categorystorage    storage   
File Size344KB,34 Pages
ManufacturerHitachi (Renesas )
Websitehttp://www.renesas.com/eng/
Download Datasheet Parametric View All

HB56UW865DB-6AU Overview

EDO DRAM Module, 8MX64, 60ns, CMOS, SODIMM-144

HB56UW865DB-6AU Parametric

Parameter NameAttribute value
MakerHitachi (Renesas )
Parts packaging codeMODULE
package instructionDIMM, DIMM144,32
Contacts144
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFAST PAGE WITH EDO
Maximum access time60 ns
I/O typeCOMMON
JESD-30 codeR-XDMA-N144
memory density536870912 bit
Memory IC TypeEDO DRAM MODULE
memory width64
Number of functions1
Number of ports1
Number of terminals144
word count8388608 words
character code8000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8MX64
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM144,32
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
self refreshYES
Maximum standby current0.0024 A
Maximum slew rate1.32 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch0.8 mm
Terminal locationDUAL
HB56UW865DB-6AU
64MB Unbuffered EDO DRAM S.O.DIMM
8-Mword
×
64-bit, 1 Bank Module
(8 pcs of 8M
×
8 components)
ADE-203-842A (Z)
Rev. 1.0
Oct. 15, 1997
Description
The HB56UW865DB-AU Series is a 8 M
×
64 Dynamic RAM Small Outline Dual In-line Memory
Module (S. O. DIMM), mounted 8 pieces of 64-Mbit DRAM (HM5165805AU) sealed in TSOP package
and 1 piece of serial EEPROM (24C02) for Presence Detect (PD). The HB56UW865DB-AU Series offers
Extended Data Out (EDO) Page Mode as a high speed access mode. An outline of the HB56UW865DB-
AU Series is 144-pin Zig Zag Dual tabs socket type compact and thin package. Therefore, the
HB56UW865DB-AU Series makes high density mounting possible without surface mount technology. The
HB56UW865DB-AU Series provides common data inputs and outputs. Decoupling capacitors are
mounted beside each TSOP on the its module board.
Features
144-pin Zig Zag Dual tabs socket type
Outline: 67.60 mm (Length)
×
25.40 mm (Height)
×
3.80 mm (Thickness)
Lead pitch : 0.80 mm
Single 3.3 V (±0.3 V)
High speed
Access time: t
RAC
= 60 ns (max)
Access time: t
CAC
= 15 ns (max)
Low power dissipation
Active mode: 4.76 W (max)
Standby mode (TTL): 57.6 mW (max)
Standby mode (CMOS): 8.6 mW (max)
JEDEC standard outline S. O. DIMM
EDO page mode capability
4096 refresh cycles: 128 ms
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