67402BJ datasheet, PDF - EEWORLD Datasheet

67402BJ: DescriptionFIFO, 64X5, 48ns, Asynchronous, TTL, CDIP18, CERAMIC, DIP-18; Categorystorage storage; File Size295KB，10 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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67402BJ Overview

FIFO, 64X5, 48ns, Asynchronous, TTL, CDIP18, CERAMIC, DIP-18

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	AMD
Parts packaging code	DIP
package instruction	DIP, DIP18,.3
Contacts	18
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	48 ns
Maximum clock frequency (fCLK)	16.7 MHz
period time	59.88 ns
JESD-30 code	R-GDIP-T18
JESD-609 code	e0
length	22.86 mm
memory density	320 bit
Memory IC Type	OTHER FIFO
memory width	5
Number of functions	1
Number of terminals	18
word count	64 words
character code	64
Operating mode	ASYNCHRONOUS
Maximum operating temperature	75 °C
Minimum operating temperature
organize	64X5
Output characteristics	TOTEM POLE
Exportable	NO
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP18,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum slew rate	0.2 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL EXTENDED
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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