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MC68HC05J3CP

Description
High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size589KB,92 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
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MC68HC05J3CP Overview

High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit

MC68HC05J3CP Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
Parts packaging codeDIP
package instructionDIP,
Contacts20
Reach Compliance Codeunknow
Has ADCNO
Other featuresALSO OPERATES AT 3.3V SUPPLY @ 1.05MHZ
Address bus width
bit size8
maximum clock frequency4.2 MHz
DAC channelNO
DMA channelNO
External data bus width
JESD-30 codeR-PDIP-T20
length26.415 mm
Number of I/O lines14
Number of terminals20
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelNO
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
ROM programmabilityMROM
Maximum seat height4.57 mm
speed2.1 MHz
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountNO
technologyHCMOS
Temperature levelINDUSTRIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width7.62 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
Freescale Semiconductor, Inc.
MC68HC05J3/D
MC68HC05J3
TECHNICAL DATA
Freescale Semiconductor, Inc...
HC05
MC68HC05J3
TECHNICAL
DATA
For More Information On This Product,
Go to: www.freescale.com

MC68HC05J3CP Related Products

MC68HC05J3CP MC68HC05J3DW MC68HC05J3 MC68HC05J3P
Description High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit
Maker Motorola ( NXP ) Motorola ( NXP ) - Motorola ( NXP )
Parts packaging code DIP SOIC - DIP
package instruction DIP, SOP, - DIP,
Contacts 20 20 - 20
Reach Compliance Code unknow unknow - unknow
Has ADC NO NO - NO
Other features ALSO OPERATES AT 3.3V SUPPLY @ 1.05MHZ ALSO OPERATES AT 3.3V SUPPLY @ 1.05MHZ - ALSO OPERATES AT 3.3V SUPPLY @ 1.05MHZ
bit size 8 8 - 8
maximum clock frequency 4.2 MHz 4.2 MHz - 4.2 MHz
DAC channel NO NO - NO
DMA channel NO NO - NO
JESD-30 code R-PDIP-T20 R-PDSO-G20 - R-PDIP-T20
length 26.415 mm 12.8 mm - 26.415 mm
Number of I/O lines 14 14 - 14
Number of terminals 20 20 - 20
Maximum operating temperature 85 °C 70 °C - 70 °C
PWM channel NO NO - NO
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code DIP SOP - DIP
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR
Package form IN-LINE SMALL OUTLINE - IN-LINE
Certification status Not Qualified Not Qualified - Not Qualified
ROM programmability MROM MROM - MROM
Maximum seat height 4.57 mm 2.65 mm - 4.57 mm
speed 2.1 MHz 2.1 MHz - 2.1 MHz
Maximum supply voltage 5.5 V 5.5 V - 5.5 V
Minimum supply voltage 4.5 V 4.5 V - 4.5 V
Nominal supply voltage 5 V 5 V - 5 V
surface mount NO YES - NO
technology HCMOS HCMOS - HCMOS
Temperature level INDUSTRIAL COMMERCIAL - COMMERCIAL
Terminal form THROUGH-HOLE GULL WING - THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm - 2.54 mm
Terminal location DUAL DUAL - DUAL
width 7.62 mm 7.5 mm - 7.62 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER - MICROCONTROLLER
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