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MC68HC05J3P

Description
High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size589KB,92 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
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MC68HC05J3P Overview

High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit

MC68HC05J3P Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
Parts packaging codeDIP
package instructionDIP,
Contacts20
Reach Compliance Codeunknow
Has ADCNO
Other featuresALSO OPERATES AT 3.3V SUPPLY @ 1.05MHZ
Address bus width
bit size8
maximum clock frequency4.2 MHz
DAC channelNO
DMA channelNO
External data bus width
JESD-30 codeR-PDIP-T20
length26.415 mm
Number of I/O lines14
Number of terminals20
Maximum operating temperature70 °C
Minimum operating temperature
PWM channelNO
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
ROM programmabilityMROM
Maximum seat height4.57 mm
speed2.1 MHz
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountNO
technologyHCMOS
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width7.62 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
Freescale Semiconductor, Inc.
MC68HC05J3/D
MC68HC05J3
TECHNICAL DATA
Freescale Semiconductor, Inc...
HC05
MC68HC05J3
TECHNICAL
DATA
For More Information On This Product,
Go to: www.freescale.com

MC68HC05J3P Related Products

MC68HC05J3P MC68HC05J3CP MC68HC05J3DW MC68HC05J3
Description High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit
Maker Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) -
Parts packaging code DIP DIP SOIC -
package instruction DIP, DIP, SOP, -
Contacts 20 20 20 -
Reach Compliance Code unknow unknow unknow -
Has ADC NO NO NO -
Other features ALSO OPERATES AT 3.3V SUPPLY @ 1.05MHZ ALSO OPERATES AT 3.3V SUPPLY @ 1.05MHZ ALSO OPERATES AT 3.3V SUPPLY @ 1.05MHZ -
bit size 8 8 8 -
maximum clock frequency 4.2 MHz 4.2 MHz 4.2 MHz -
DAC channel NO NO NO -
DMA channel NO NO NO -
JESD-30 code R-PDIP-T20 R-PDIP-T20 R-PDSO-G20 -
length 26.415 mm 26.415 mm 12.8 mm -
Number of I/O lines 14 14 14 -
Number of terminals 20 20 20 -
Maximum operating temperature 70 °C 85 °C 70 °C -
PWM channel NO NO NO -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code DIP DIP SOP -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR -
Package form IN-LINE IN-LINE SMALL OUTLINE -
Certification status Not Qualified Not Qualified Not Qualified -
ROM programmability MROM MROM MROM -
Maximum seat height 4.57 mm 4.57 mm 2.65 mm -
speed 2.1 MHz 2.1 MHz 2.1 MHz -
Maximum supply voltage 5.5 V 5.5 V 5.5 V -
Minimum supply voltage 4.5 V 4.5 V 4.5 V -
Nominal supply voltage 5 V 5 V 5 V -
surface mount NO NO YES -
technology HCMOS HCMOS HCMOS -
Temperature level COMMERCIAL INDUSTRIAL COMMERCIAL -
Terminal form THROUGH-HOLE THROUGH-HOLE GULL WING -
Terminal pitch 2.54 mm 2.54 mm 1.27 mm -
Terminal location DUAL DUAL DUAL -
width 7.62 mm 7.62 mm 7.5 mm -
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER -
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