|
LM725MW8 |
LM725MD8 |
| Description |
IC OP-AMP, 1500 uV OFFSET-MAX, UUC, WAFER, Operational Amplifier |
IC OP-AMP, 1500 uV OFFSET-MAX, UUC, DIE, Operational Amplifier |
| Is it Rohs certified? |
conform to |
conform to |
| Parts packaging code |
WAFER |
WAFER |
| package instruction |
DIE, WAFER |
DIE, DIE OR CHIP |
| Reach Compliance Code |
compliant |
compliant |
| ECCN code |
EAR99 |
EAR99 |
| Amplifier type |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
| Architecture |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB) |
0.1 µA |
0.1 µA |
| Maximum bias current (IIB) at 25C |
0.1 µA |
0.1 µA |
| Nominal Common Mode Rejection Ratio |
120 dB |
120 dB |
| frequency compensation |
NO |
NO |
| Maximum input offset voltage |
1500 µV |
1500 µV |
| JESD-30 code |
X-XUUC-N |
X-XUUC-N |
| low-dissonance |
NO |
NO |
| Humidity sensitivity level |
1 |
1 |
| Negative supply voltage upper limit |
-22 V |
-22 V |
| Nominal Negative Supply Voltage (Vsup) |
-15 V |
-15 V |
| Number of functions |
1 |
1 |
| Maximum operating temperature |
125 °C |
125 °C |
| Minimum operating temperature |
-55 °C |
-55 °C |
| Package body material |
UNSPECIFIED |
UNSPECIFIED |
| encapsulated code |
DIE |
DIE |
| Encapsulate equivalent code |
WAFER |
DIE OR CHIP |
| Package shape |
UNSPECIFIED |
UNSPECIFIED |
| Package form |
UNCASED CHIP |
UNCASED CHIP |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
| power supply |
+-15 V |
+-15 V |
| Certification status |
Not Qualified |
Not Qualified |
| Filter level |
38535Q/M;38534H;883B |
38535Q/M;38534H;883B |
| Nominal slew rate |
0.2 V/us |
0.2 V/us |
| Supply voltage upper limit |
22 V |
22 V |
| Nominal supply voltage (Vsup) |
15 V |
15 V |
| surface mount |
YES |
YES |
| technology |
BIPOLAR |
BIPOLAR |
| Temperature level |
MILITARY |
MILITARY |
| Terminal form |
NO LEAD |
NO LEAD |
| Terminal location |
UPPER |
UPPER |
| Maximum time at peak reflow temperature |
40 |
40 |
| Minimum voltage gain |
1000000 |
1000000 |
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