Soldering process must comply with National Semiconduc-
tor’s Reflow Temperature Profile specifications. Refer to
www.national.com/packaging.(Note
3)
LM56 Electrical Characteristics
The following specifications apply for V
+
= 2.7 V
DC
, and V
REF
load current = 50 µA unless otherwise specified.
Boldface limits
apply for T
A
= T
J
= T
MIN
to T
MAX
;
all other limits T
A
= T
J
= 25˚C unless otherwise specified.
Typical
Symbol
Temperature Sensor
Trip Point Accuracy (Includes
V
REF
, Comparator Offset, and
Temperature Sensitivity errors)
Trip Point Hysteresis
+25˚C
≤
T
A
≤
+85˚C
−40˚C
≤
T
A
≤
+125˚C
T
A
= −40˚C
T
A
= +25˚C
T
A
= +85˚C
T
A
= +125˚C
Internal Temperature
Sensitivity
Temperature Sensitivity Error
Output Impedance
Line Regulation
−1 µA
≤
I
L
≤
+40 µA
+3.0V
≤
V
≤
+10V,
+25 ˚C
≤
T
A
≤
+85 ˚C
+
LM56BIM
Limits
(Note 7)
LM56CIM
Limits
(Note 7)
Units
(Limits)
Parameter
Conditions
(Note 6)
±
2
±
2
±
3
4
5
6
6
+6.20
3
6
3.5
6.5
4.5
7.5
4
8
±
3
±
3
±
4
3
6
3.5
6.5
4.5
7.5
4
8
˚C (max)
˚C (max)
˚C (max)
˚C (min)
˚C (max)
˚C (min)
˚C (max)
˚C (min)
˚C (max)
˚C (min)
˚C (max)
mV/˚C
±
2
±
3
1500
±
3
±
4
1500
˚C (max)
˚C (max)
Ω
(max)
mV/V (max)
mV/V (max)
mV (max)
nA (max)
V
V
±
0.36
±
0.61
±
2.3
150
V
+
− 1
GND
2
1.250V
8
300
±
0.36
±
0.61
±
2.3
300
+3.0V
≤
V
+
≤
+10V,
−40 ˚C
≤
T
A
<
25 ˚C
+2.7V
≤
V
+
≤
+3.3V
V
T1
and V
T2
Analog Inputs
I
BIAS
V
IN
V
OS
V
REF
Output
V
REF
V
REF
Nominal
V
REF
Error
∆V
REF
/∆V
+
∆V
REF
/∆I
L
Line Regulation
Load Regulation Sourcing
+3.0V
≤
V
+
≤
+10V
+2.7V
≤
V
≤
+3.3V
+
Analog Input Bias Current
Analog Input Voltage Range
Comparator Offset
8
mV (max)
V
±
1
±
12.5
0.13
0.15
0.25
1.1
0.15
±
1
±
12.5
0.25
1.1
0.15
% (max)
mV (max)
mV/V (max)
mV (max)
mV/µA (max)
+30 µA
≤
I
L
≤
+50 µA
3
www.national.com
LM56
Symbol
V
+
Power Supply
I
S
Digital Outputs
I
OUT(“1”)
V
OUT(“0”)
Parameter
Conditions
Typical
(Note 6)
Limits
(Note 7)
230
230
1
0.4
Units
(Limits)
µA (max)
µA (max)
µA (max)
V (max)
Supply Current
V
+
= +10V
V = +2.7V
+
Logical “1” Output Leakage
Current
Logical “0” Output Voltage
V
+
= +5.0V
I
OUT
= +50 µA
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2:
When the input voltage (V
I
) at any pin exceeds the power supply (V
I
<
GND or V
I
>
V
+
), the current at that pin should be limited to 5 mA. The 20 mA
maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four.
Note 3:
Reflow temperature profiles are different for lead-free and non-lead-free packages.
Note 4:
The maximum power dissipation must be derated at elevated temperatures and is dictated by T
Jmax
(maximum junction temperature),
θ
JA
(junction to
ambient thermal resistance) and T
A
(ambient temperature). The maximum allowable power dissipation at any temperature is P
D
= (T
Jmax
–T
A
)/θ
JA
or the number
given in the Absolute Maximum Ratings, whichever is lower. For this device, T
Jmax
= 125˚C. For this device the typical thermal resistance (θ
JA
) of the different
package types when board mounted follow:
Package Type
M08A
MUA08A
θ
JA
110˚C/W
250˚C/W
Note 5:
The human body model is a 100 pF capacitor discharge through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin.
Note 6:
Typicals are at T
J
= T
A
= 25˚C and represent most likely parametric norm.
Note 7:
Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
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