1F1G THRU 1F7G
FAST RECOVERY GLASS PASSIVATED
JUNCTION RECTIFIER
VOLTAGE: 50 TO 1000V
CURRENT: 1.0A
FEATURE
Molded case feature for auto insertion
High current capability
Low leakage current
High surge capability
High temperature soldering guaranteed
250°C /10sec/0.375" lead length at 5 lbs tension
Glass Passivated chip
R-1
MECHANICAL DATA
Terminal: Plated axial leads solderable per
MIL-STD 202E, method 208C
Case: Molded with UL-94 Class V-0 recognized Flame
Retardant Epoxy
Polarity: color band denotes cathode
Mounting position: any
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(single-phase, half-wave, 60HZ, resistive or inductive load rating at 25°C, unless otherwise stated,
for capacitive load, derate current by 20%)
SYMBOL
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC blocking Voltage
Maximum Average Forward Rectified
Current 3/8
"
lead length at Ta =50
°
C
Peak Forward Surge Current 8.3ms single
Half sine-wave superimposed on rated load
Maximum Instantaneous Forward Voltage at
rated forward current
Maximum full load reverse current
full cycle at T
L
=75
°
C
Maximum DC Reverse Current
Ta =25
°
C
at rated DC blocking voltage
Ta =100
°
C
Typical Junction Capacitance
(Note 1)
Maximum Reverse Recovery Time (Note 2)
Vrrm
Vrms
Vdc
If(av)
Ifsm
Vf
Ir(av)
Ir
Cj
Trr
1F
1G
50
35
50
1F
2G
100
70
100
1F
3G
200
140
200
1F
4G
400
280
400
1.0
30.0
1.3
30.0
5.0
100.0
15.0
1F
5G
600
420
600
1F
6G
800
560
800
1F
7G
1000
700
1000
units
V
V
V
A
A
V
µ
A
µ
A
µ
A
150
50.0
-55 to +150
250
500
pF
nS
Operating Temperature
(Note 3)
Storage and Operation Junction Temperature
R(ja)
Tstg, Tj
°
/W
C
°
C
Note:
1. Measured at 1.0 MHz and applied voltage of 4.0Vdc
2. Test Condition If
=0.5A,
Ir =1.0A, Irr =0.25A
3. Thermal Resistance from Junction to Ambient at 0.375" lead length, P.C. Board Mounted
Rev.4
www.gulfsemi.com
FPGA/CPLD
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