Serial I/O Controller, 1 Channel(s), 0.002288818359375MBps, CMOS, CDIP28, CERAMIC, DIP-28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | California Micro Devices |
| Parts packaging code | DIP |
| package instruction | DIP, DIP28,.6 |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| Address bus width | 2 |
| boundary scan | NO |
| Bus compatibility | 6500; 6800 |
| maximum clock frequency | 1 MHz |
| letter of agreement | ASYNC, BIT |
| Data encoding/decoding methods | NRZ |
| Maximum data transfer rate | 0.002288818359375 MBps |
| External data bus width | 8 |
| JESD-30 code | R-CDIP-T28 |
| JESD-609 code | e0 |
| low power mode | NO |
| Number of DMA channels | |
| Number of I/O lines | |
| Number of serial I/Os | 1 |
| Number of terminals | 28 |
| On-chip data RAM width | |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (number of words) | 0 |
| Maximum seat height | 5.72 mm |
| Maximum slew rate | 2 mA |
| Maximum supply voltage | 5.25 V |
| Minimum supply voltage | 4.75 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| G65SC51CI-1 | G65SC51C-4 | G65SC51DI-1 | G65SC51DI-4 | G65SC51E-1 | G65SC51E-2 | G65SC51L-1 | G65SC51L-2 | G65SC51LI-1 | G65SC51P-1 | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Serial I/O Controller, 1 Channel(s), 0.002288818359375MBps, CMOS, CDIP28, CERAMIC, DIP-28 | Serial I/O Controller, 1 Channel(s), 0.002288818359375MBps, CMOS, CDIP28, CERAMIC, DIP-28 | Serial I/O Controller, 1 Channel(s), 0.002288818359375MBps, CMOS, CDIP28, CERDIP-28 | Serial I/O Controller, 1 Channel(s), 0.002288818359375MBps, CMOS, CDIP28, CERDIP-28 | Serial IO/Communication Controller, CMOS, PQCC28 | Serial IO/Communication Controller, CMOS, PQCC28 | Serial IO/Communication Controller, CMOS, CQCC28 | Serial IO/Communication Controller, CMOS, CQCC28 | Serial IO/Communication Controller, CMOS, CQCC28 | Serial I/O Controller, 1 Channel(s), 0.002288818359375MBps, CMOS, PDIP28, PLASTIC, DIP-28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices |
| package instruction | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | QCCJ, LDCC28,.5SQ | QCCJ, LDCC28,.5SQ | QCCN, LCC28(UNSPEC) | QCCN, LCC28(UNSPEC) | QCCN, LCC28(UNSPEC) | DIP, DIP28,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Maximum operating temperature | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | QCCJ | QCCJ | QCCN | QCCN | QCCN | DIP |
| Encapsulate equivalent code | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | LDCC28,.5SQ | LDCC28,.5SQ | LCC28(UNSPEC) | LCC28(UNSPEC) | LCC28(UNSPEC) | DIP28,.6 |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | YES | YES | YES | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD | QUAD | QUAD | DUAL |
| JESD-30 code | R-CDIP-T28 | R-CDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | S-PQCC-J28 | S-PQCC-J28 | - | - | - | R-PDIP-T28 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | - | - | - | RECTANGULAR |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | - | - | - | 2.54 mm |
京公网安备 11010802033920号
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