Serial IO/Communication Controller, CMOS, PQCC28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | California Micro Devices |
| package instruction | QCCJ, LDCC28,.5SQ |
| Reach Compliance Code | unknown |
| JESD-30 code | S-PQCC-J28 |
| JESD-609 code | e0 |
| Number of terminals | 28 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC28,.5SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| G65SC51E-2 | G65SC51C-4 | G65SC51CI-1 | G65SC51DI-1 | G65SC51DI-4 | G65SC51E-1 | G65SC51L-1 | G65SC51L-2 | G65SC51LI-1 | G65SC51P-1 | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Serial IO/Communication Controller, CMOS, PQCC28 | Serial I/O Controller, 1 Channel(s), 0.002288818359375MBps, CMOS, CDIP28, CERAMIC, DIP-28 | Serial I/O Controller, 1 Channel(s), 0.002288818359375MBps, CMOS, CDIP28, CERAMIC, DIP-28 | Serial I/O Controller, 1 Channel(s), 0.002288818359375MBps, CMOS, CDIP28, CERDIP-28 | Serial I/O Controller, 1 Channel(s), 0.002288818359375MBps, CMOS, CDIP28, CERDIP-28 | Serial IO/Communication Controller, CMOS, PQCC28 | Serial IO/Communication Controller, CMOS, CQCC28 | Serial IO/Communication Controller, CMOS, CQCC28 | Serial IO/Communication Controller, CMOS, CQCC28 | Serial I/O Controller, 1 Channel(s), 0.002288818359375MBps, CMOS, PDIP28, PLASTIC, DIP-28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices |
| package instruction | QCCJ, LDCC28,.5SQ | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | QCCJ, LDCC28,.5SQ | QCCN, LCC28(UNSPEC) | QCCN, LCC28(UNSPEC) | QCCN, LCC28(UNSPEC) | DIP, DIP28,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Maximum operating temperature | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | QCCJ | DIP | DIP | DIP | DIP | QCCJ | QCCN | QCCN | QCCN | DIP |
| Encapsulate equivalent code | LDCC28,.5SQ | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | LDCC28,.5SQ | LCC28(UNSPEC) | LCC28(UNSPEC) | LCC28(UNSPEC) | DIP28,.6 |
| Package form | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO | NO | NO | YES | YES | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE |
| Terminal location | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD | QUAD | DUAL |
| JESD-30 code | S-PQCC-J28 | R-CDIP-T28 | R-CDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | S-PQCC-J28 | - | - | - | R-PDIP-T28 |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | - | - | - | RECTANGULAR |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | - | - | - | 2.54 mm |
京公网安备 11010802033920号
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