EEPROM, 512X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DIP |
| package instruction | DIP, DIP8,.3 |
| Contacts | 8 |
| Reach Compliance Code | _compli |
| ECCN code | EAR99 |
| Maximum clock frequency (fCLK) | 0.4 MHz |
| Data retention time - minimum | 10 |
| Durability | 100000 Write/Erase Cycles |
| I2C control byte | 1010DDMR |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e0 |
| length | 9.3218 mm |
| memory density | 4096 bi |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 512 words |
| character code | 512 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512X8 |
| Output characteristics | OPEN-DRAIN |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.572 mm |
| Serial bus type | I2C |
| Maximum standby current | 0.000008 A |
| Maximum slew rate | 0.002 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 7.62 mm |
| Maximum write cycle time (tWC) | 10 ms |
| write protect | HARDWARE |
| Base Number Matches | 1 |
| IS24C04-P | IS24C04-PI | IS24C04-G | IS24C04-GI | |
|---|---|---|---|---|
| Description | EEPROM, 512X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | EEPROM, 512X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, SOIC-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, SOIC-8 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | DIP | DIP | SOIC | SOIC |
| package instruction | DIP, DIP8,.3 | DIP, DIP8,.3 | SOIC-8 | SOIC-8 |
| Contacts | 8 | 8 | 8 | 8 |
| Reach Compliance Code | _compli | _compli | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum clock frequency (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz |
| Data retention time - minimum | 10 | 10 | 10 | 10 |
| Durability | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| I2C control byte | 1010DDMR | 1010DDMR | 1010DDMR | 1010DDMR |
| JESD-30 code | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| length | 9.3218 mm | 9.3218 mm | 4.9 mm | 4.9 mm |
| memory density | 4096 bi | 4096 bi | 4096 bit | 4096 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 |
| word count | 512 words | 512 words | 512 words | 512 words |
| character code | 512 | 512 | 512 | 512 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 85 °C | 70 °C | 85 °C |
| organize | 512X8 | 512X8 | 512X8 | 512X8 |
| Output characteristics | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | SOP | SOP |
| Encapsulate equivalent code | DIP8,.3 | DIP8,.3 | SOP8,.25 | SOP8,.25 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | 240 | 240 | 240 | 240 |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.572 mm | 4.572 mm | 1.75 mm | 1.75 mm |
| Serial bus type | I2C | I2C | I2C | I2C |
| Maximum standby current | 0.000008 A | 0.000008 A | 0.000008 A | 0.000008 A |
| Maximum slew rate | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 |
| width | 7.62 mm | 7.62 mm | 3.9 mm | 3.9 mm |
| Maximum write cycle time (tWC) | 10 ms | 10 ms | 10 ms | 10 ms |
| write protect | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
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