IS24C04-PI datasheet, PDF - EEWORLD Datasheet

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IS24C04-PI: DescriptionEEPROM, 512X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8; Categorystorage storage; File Size416KB，10 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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IS24C04-PI Overview

EEPROM, 512X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8

IS24C04-PI Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	DIP, DIP8,.3
Contacts	8
Reach Compliance Code	_compli
ECCN code	EAR99
Maximum clock frequency (fCLK)	0.4 MHz
Data retention time - minimum	10
Durability	100000 Write/Erase Cycles
I2C control byte	1010DDMR
JESD-30 code	R-PDIP-T8
JESD-609 code	e0
length	9.3218 mm
memory density	4096 bi
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	512 words
character code	512
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512X8
Output characteristics	OPEN-DRAIN
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	240
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.572 mm
Serial bus type	I2C
Maximum standby current	0.000008 A
Maximum slew rate	0.002 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	7.62 mm
Maximum write cycle time (tWC)	10 ms
write protect	HARDWARE
Base Number Matches	1

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IS24C04-PI Related Products

	IS24C04-PI	IS24C04-P	IS24C04-G	IS24C04-GI
Description	EEPROM, 512X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8	EEPROM, 512X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8	EEPROM, 512X8, Serial, CMOS, PDSO8, SOIC-8	EEPROM, 512X8, Serial, CMOS, PDSO8, SOIC-8
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	DIP	SOIC	SOIC
package instruction	DIP, DIP8,.3	DIP, DIP8,.3	SOIC-8	SOIC-8
Contacts	8	8	8	8
Reach Compliance Code	_compli	_compli	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	0.4 MHz	0.4 MHz	0.4 MHz	0.4 MHz
Data retention time - minimum	10	10	10	10
Durability	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles
I2C control byte	1010DDMR	1010DDMR	1010DDMR	1010DDMR
JESD-30 code	R-PDIP-T8	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8
JESD-609 code	e0	e0	e0	e0
length	9.3218 mm	9.3218 mm	4.9 mm	4.9 mm
memory density	4096 bi	4096 bi	4096 bit	4096 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	8	8	8	8
word count	512 words	512 words	512 words	512 words
character code	512	512	512	512
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	85 °C
organize	512X8	512X8	512X8	512X8
Output characteristics	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP	SOP
Encapsulate equivalent code	DIP8,.3	DIP8,.3	SOP8,.25	SOP8,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	240	240	240	240
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.572 mm	4.572 mm	1.75 mm	1.75 mm
Serial bus type	I2C	I2C	I2C	I2C
Maximum standby current	0.000008 A	0.000008 A	0.000008 A	0.000008 A
Maximum slew rate	0.002 mA	0.002 mA	0.002 mA	0.002 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30	30
width	7.62 mm	7.62 mm	3.9 mm	3.9 mm
Maximum write cycle time (tWC)	10 ms	10 ms	10 ms	10 ms
write protect	HARDWARE	HARDWARE	HARDWARE	HARDWARE

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