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SN74AUC2G07YZPR

Description
Dual Buffer/Driver with Open-Drain Outputs 6-DSBGA -40 to 85
Categorylogic    logic   
File Size971KB,17 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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SN74AUC2G07YZPR Overview

Dual Buffer/Driver with Open-Drain Outputs 6-DSBGA -40 to 85

SN74AUC2G07YZPR Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeBGA
package instructionVFBGA, BGA6,2X3,20
Contacts6
Reach Compliance Codecompli
ECCN codeEAR99
Factory Lead Time1 week
seriesAUC
JESD-30 codeR-XBGA-B6
JESD-609 codee1
length1.4 mm
Load capacitance (CL)15 pF
Logic integrated circuit typeBUFFER
MaximumI(ol)0.009 A
Humidity sensitivity level1
Number of functions2
Number of entries1
Number of terminals6
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristicsOPEN-DRAIN
Package body materialUNSPECIFIED
encapsulated codeVFBGA
Encapsulate equivalent codeBGA6,2X3,20
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packingTR
Peak Reflow Temperature (Celsius)260
power supply1.2/2.5 V
Maximum supply current (ICC)0.01 mA
Prop。Delay @ Nom-Su3.1 ns
propagation delay (tpd)3.1 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height0.5 mm
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)0.8 V
Nominal supply voltage (Vsup)1.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width0.9 mm

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Description Dual Buffer/Driver with Open-Drain Outputs 6-DSBGA -40 to 85 Dual Buffer/Driver with Open-Drain Outputs 6-SOT-23 -40 to 85 Dual Buffer/Driver with Open-Drain Outputs 6-SOT-23 -40 to 85 Dual Buffer/Driver with Open-Drain Outputs 6-SC70 -40 to 85 Dual Buffer/Driver with Open-Drain Outputs 6-SC70 -40 to 85 Dual Buffer/Driver with Open-Drain Outputs 6-SC70 -40 to 85 IC BUF NON-INVERT 2.7 V 6DSBGA
Is it Rohs certified? conform to conform to conform to conform to conform to conform to incompatible
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code BGA SOT-23 SOT-23 SOIC SOIC SOIC BGA
package instruction VFBGA, BGA6,2X3,20 LSSOP, TSOP6,.11,37 LSSOP, TSOP6,.11,37 SC-70, 6 PIN TSSOP, TSSOP6,.08 TSSOP, TSSOP6,.08 VFBGA, BGA6,2X3,20
Contacts 6 6 6 6 6 6 6
Reach Compliance Code compli compli compli compliant compli compli not_compliant
Factory Lead Time 1 week 1 week 6 weeks 6 weeks 6 weeks 6 weeks 1 week
series AUC AUC AUC AUC AUC AUC AUC
JESD-30 code R-XBGA-B6 R-PDSO-G6 R-PDSO-G6 R-PDSO-G6 R-PDSO-G6 R-PDSO-G6 R-XBGA-B6
length 1.4 mm 2.9 mm 2.9 mm 2 mm 2 mm 2 mm 1.4 mm
Load capacitance (CL) 15 pF 15 pF 15 pF 15 pF 15 pF 15 pF 15 pF
Logic integrated circuit type BUFFER BUFFER BUFFER BUFFER BUFFER BUFFER BUFFER
MaximumI(ol) 0.009 A 0.009 A 0.009 A 0.009 A 0.009 A 0.009 A 0.005 A
Number of functions 2 2 2 2 2 2 2
Number of entries 1 1 1 1 1 1 1
Number of terminals 6 6 6 6 6 6 6
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN
Package body material UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED
encapsulated code VFBGA LSSOP LSSOP TSSOP TSSOP TSSOP VFBGA
Encapsulate equivalent code BGA6,2X3,20 TSOP6,.11,37 TSOP6,.11,37 TSSOP6,.08 TSSOP6,.08 TSSOP6,.08 BGA6,2X3,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing TR TR TR TR TR TR TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 NOT SPECIFIED
power supply 1.2/2.5 V 1.2/2.5 V 1.2/2.5 V 1.2/2.5 V 1.2/2.5 V 1.2/2.5 V 1.2/2.5 V
propagation delay (tpd) 3.1 ns 3.1 ns 3.1 ns 3.1 ns 3.1 ns 3.1 ns 3.1 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO NO NO NO NO
Maximum seat height 0.5 mm 1.45 mm 1.45 mm 1.1 mm 1.1 mm 1.1 mm 0.5 mm
Maximum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Minimum supply voltage (Vsup) 0.8 V 0.8 V 0.8 V 0.8 V 0.8 V 0.8 V 0.8 V
Nominal supply voltage (Vsup) 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL GULL WING GULL WING GULL WING GULL WING GULL WING BALL
Terminal pitch 0.5 mm 0.95 mm 0.95 mm 0.65 mm 0.65 mm 0.65 mm 0.5 mm
Terminal location BOTTOM DUAL DUAL DUAL DUAL DUAL BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 0.9 mm 1.6 mm 1.6 mm 1.25 mm 1.25 mm 1.25 mm 0.9 mm
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments -
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free -
ECCN code EAR99 EAR99 - EAR99 EAR99 - -
JESD-609 code e1 e4 e4 e4 e4 e4 -
Humidity sensitivity level 1 1 1 1 1 1 -
Maximum supply current (ICC) 0.01 mA 0.01 mA 0.01 mA 0.01 mA 0.01 mA 0.01 mA -
Prop。Delay @ Nom-Su 3.1 ns 3.1 ns 3.1 ns - 3.1 ns 3.1 ns -
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) -
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