EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

SN74AUP1G99DCTR

Description
Low-Power Ultra-Configurable Multiple-Function Gate with 3-State Outputs 8-SM8 -40 to 85
Categorylogic    logic   
File Size1MB,27 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
Stay tuned Parametric Compare

SN74AUP1G99DCTR Online Shopping

Suppliers Part Number Price MOQ In stock  
SN74AUP1G99DCTR - - View Buy Now

SN74AUP1G99DCTR Overview

Low-Power Ultra-Configurable Multiple-Function Gate with 3-State Outputs 8-SM8 -40 to 85

SN74AUP1G99DCTR Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeSOIC
package instructionLSSOP, SSOP8,.16
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Factory Lead Time1 week
seriesAUP/ULP/V
JESD-30 codeR-PDSO-G8
JESD-609 codee4
length2.95 mm
Load capacitance (CL)30 pF
Logic integrated circuit typeLOGIC CIRCUIT
MaximumI(ol)0.004 A
Humidity sensitivity level1
Number of functions1
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeLSSOP
Encapsulate equivalent codeSSOP8,.16
Package shapeRECTANGULAR
Package formSMALL OUTLINE, LOW PROFILE, SHRINK PITCH
method of packingTR
Peak Reflow Temperature (Celsius)260
power supply1.2/3.3 V
Prop。Delay @ Nom-Su36.1 ns
Certification statusNot Qualified
Schmitt triggerYES
Maximum seat height1.3 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)0.8 V
Nominal supply voltage (Vsup)1.1 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width2.8 mm
Base Number Matches1

SN74AUP1G99DCTR Related Products

SN74AUP1G99DCTR SN74AUP1G99DCUT SN74AUP1G99DCUTE4 SN74AUP1G99YZPR SN74AUP1G99DCTT SN74AUP1G99DCUR
Description Low-Power Ultra-Configurable Multiple-Function Gate with 3-State Outputs 8-SM8 -40 to 85 Low-Power Ultra-Configurable Multiple-Function Gate with 3-State Outputs 8-VSSOP -40 to 85 Logic Gates Lo PWR Ultra Config Multi Funct Gate Low-Power Ultra-Configurable Multiple-Function Gate with 3-State Outputs 8-DSBGA -40 to 85 Low-Power Ultra-Configurable Multiple-Function Gate with 3-State Outputs 8-SM8 -40 to 85 Low-Power Ultra-Configurable Multiple-Function Gate with 3-State Outputs 8-VSSOP -40 to 85
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? Lead free Lead free Contains lead Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code SOIC SOIC SOIC BGA SOIC SOIC
package instruction LSSOP, SSOP8,.16 VSSOP, TSSOP8,.12,20 VSSOP, TSSOP8,.12,20 VFBGA, BGA8,2X4,20 LSSOP, SSOP8,.16 VSSOP, TSSOP8,.12,20
Contacts 8 8 8 8 8 8
Reach Compliance Code compli compli compli compli compli compli
series AUP/ULP/V AUP/ULP/V AUP/ULP/V AUP/ULP/V AUP/ULP/V AUP/ULP/V
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PBGA-B8 R-PDSO-G8 R-PDSO-G8
JESD-609 code e4 e4 e4 e1 e4 e4
length 2.95 mm 2.3 mm 2.3 mm 1.9 mm 2.95 mm 2.3 mm
Load capacitance (CL) 30 pF 30 pF 30 pF 30 pF 30 pF 30 pF
Logic integrated circuit type LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT
MaximumI(ol) 0.004 A 0.004 A 0.0017 A 0.004 A 0.004 A 0.004 A
Humidity sensitivity level 1 1 1 1 1 1
Number of functions 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LSSOP VSSOP VSSOP VFBGA LSSOP VSSOP
Encapsulate equivalent code SSOP8,.16 TSSOP8,.12,20 TSSOP8,.12,20 BGA8,2X4,20 SSOP8,.16 TSSOP8,.12,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
method of packing TR TR TAPE AND REEL TR TR TR
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260
power supply 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V
Prop。Delay @ Nom-Su 36.1 ns 36.1 ns 36.1 ns 36.1 ns 36.1 ns 36.1 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger YES YES YES YES YES YES
Maximum seat height 1.3 mm 0.9 mm 0.9 mm 0.5 mm 1.3 mm 0.9 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 0.8 V 0.8 V 0.8 V 0.8 V 0.8 V 0.8 V
Nominal supply voltage (Vsup) 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Silver/Copper (Sn/Ag/Cu) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING GULL WING GULL WING BALL GULL WING GULL WING
Terminal pitch 0.65 mm 0.5 mm 0.5 mm 0.5 mm 0.65 mm 0.5 mm
Terminal location DUAL DUAL DUAL BOTTOM DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 2.8 mm 2 mm 2 mm 0.9 mm 2.8 mm 2 mm
Factory Lead Time 1 week 1 week - 1 week 1 week 1 week
Output polarity TRUE TRUE - TRUE TRUE TRUE
Base Number Matches 1 1 1 - 1 1
[Questions about cmd file address allocation, please help]
I recently created a new project, and there are always warnings when compiling. I think there is something wrong with the cmd file, so I have to learn about cmd files. Now I have a question that I wou...
jonny0811 Microcontroller MCU
STM32 ADC problem
If I use a power bank to power the board, and then need to get the digital signal of the input voltage in real time through the ADC module, the question is, how should I connect the ADC input? Because...
joooooder MCU
ARM application and selection
[align=left]32-bit RISC CPU ARM chip application and selection The status and development of ARM company and ARM chips, introduces the selection method of ARM chips from the application perspective, a...
呱呱 ARM Technology
Can programs developed based on wince6.0 run on mobile phones [wince 6.0 system] produced by different mobile phone manufacturers?
Dear friends: Can programs developed based on wince6.0 run on mobile phones [wince 6.0 system] produced by different mobile phone manufacturers? Because wince is related to hardware, I am worried that...
tangwenwenit Embedded System
A simple helloworld application needs to link those DLLs to run on WINCE?
RT I would like to know more, thank you....
xilanruowu Embedded System
Recent powerful machines (mobile phones) based on TI processors
Mobile phones based on OMAP3630 processor: 1. Nokia N9, N950 2. Moto ME722, ME811, Droid2, Droid X, Defy 3. Samsung Galaxy S (I9003) and i9008 4. Coolpad 8811 5. LG Optimus Mach LU3000 ... The key poi...
liling DSP and ARM Processors

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 810  1373  233  212  2422  17  28  5  49  47 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号