SN74LVC1G34DCKTE4 datasheet, PDF

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SN74LVC1G34DCKTE4: DescriptionBuffer 1-CH Non-Inverting CMOS 5-Pin SC-70 T/R; CategoryBuffer and line drives; File Size806KB，19 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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SN74LVC1G34DCKTE4 Overview

Buffer 1-CH Non-Inverting CMOS 5-Pin SC-70 T/R

SN74LVC1G34DCKTE4 Parametric

Parameter Name	Attribute value
EU restricts the use of certain hazardous substances	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
SVHC	Yes
Logic Family	LVC
Logic Function	Buffer
Number of Elements per Chip	1
Number of Channels per Chip	1
Number of Inputs per Chip	1
Number of Input Enables per Chip	0
Number of Outputs per Chip	1
Number of Output Enables per Chip	0
Bus Hold	No
Polarity	Non-Inverting
Maximum Propagation Delay Time @ Maximum CL (ns)	4.1@3.3V\|3.2@5V
Absolute Propagation Delay Time (ns)	9.9
Process Technology	CMOS
Input Signal Type	Single-Ended
Output Type	Push-Pull
Maximum Low Level Output Current (mA)	32
Maximum High Level Output Current (mA)	-32
Minimum Operating Supply Voltage (V)	1.65
Typical Operating Supply Voltage (V)	2.5\|3.3\|5\|1.8
Maximum Operating Supply Voltage (V)	5.5
Tolerant I/Os (V)	5
Maximum Quiescent Current (uA)	1
Propagation Delay Test Condition (pF)	50
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	125
Packaging	Tape and Reel
Standard Package Name	SOT-323
Pin Count	5
Supplier Package	SC-70
Mounting	Surface Mount
Package Height	1(Max)
Package Length	2.15(Max)
Package Width	1.4(Max)
PCB changed	5
Lead Shape	Gull-wing

SN74LVC1G34DCKTE4 Related Products

	SN74LVC1G34DCKTE4	SN74LVC1G34DBVTG4	SN74LVC1G34YFPR
Description	Buffer 1-CH Non-Inverting CMOS 5-Pin SC-70 T/R	Single Buffer Gate 5-SOT-23 -40 to 125	Single Buffer Gate 4-DSBGA -40 to 85
Brand Name	-	Texas Instruments	Texas Instruments
Is it lead-free?	-	Lead free	Lead free
Is it Rohs certified?	-	conform to	conform to
Maker	-	Texas Instruments	Texas Instruments
Parts packaging code	-	SOT-23	BGA
package instruction	-	LSSOP, TSOP5/6,.11,37	VFBGA, BGA4,2X2,16
Contacts	-	5	4
Reach Compliance Code	-	compli	compli
Factory Lead Time	-	6 weeks	1 week
series	-	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	-	R-PDSO-G5	S-XBGA-B4
JESD-609 code	-	e4	e1
length	-	2.9 mm	0.8 mm
Load capacitance (CL)	-	50 pF	50 pF
Logic integrated circuit type	-	BUFFER	BUFFER
MaximumI(ol)	-	0.032 A	0.032 A
Humidity sensitivity level	-	1	1
Number of functions	-	1	1
Number of entries	-	1	1
Number of terminals	-	5	4
Maximum operating temperature	-	125 °C	85 °C
Minimum operating temperature	-	-40 °C	-40 °C
Output characteristics	-	3-STATE	3-STATE
Package body material	-	PLASTIC/EPOXY	UNSPECIFIED
encapsulated code	-	LSSOP	VFBGA
Encapsulate equivalent code	-	TSOP5/6,.11,37	BGA4,2X2,16
Package shape	-	RECTANGULAR	SQUARE
Package form	-	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing	-	TR	TR
Peak Reflow Temperature (Celsius)	-	260	260
power supply	-	3.3 V	3.3 V
Maximum supply current (ICC)	-	0.001 mA	0.001 mA
Prop。Delay @ Nom-Su	-	4.1 ns	4.1 ns
propagation delay (tpd)	-	9.9 ns	9.9 ns
Certification status	-	Not Qualified	Not Qualified
Schmitt trigger	-	NO	NO
Maximum seat height	-	1.45 mm	0.5 mm
Maximum supply voltage (Vsup)	-	5.5 V	5.5 V
Minimum supply voltage (Vsup)	-	1.65 V	1.65 V
Nominal supply voltage (Vsup)	-	3.3 V	3.3 V
surface mount	-	YES	YES
technology	-	CMOS	CMOS
Temperature level	-	AUTOMOTIVE	INDUSTRIAL
Terminal surface	-	Nickel/Palladium/Gold (Ni/Pd/Au)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	-	GULL WING	BALL
Terminal pitch	-	0.95 mm	0.4 mm
Terminal location	-	DUAL	BOTTOM
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED
width	-	1.6 mm	0.8 mm

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