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SN74LVC1G34YFPR

Description
Single Buffer Gate 4-DSBGA -40 to 85
Categorylogic    logic   
File Size806KB,19 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
Stay tuned Parametric Compare

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SN74LVC1G34YFPR Overview

Single Buffer Gate 4-DSBGA -40 to 85

SN74LVC1G34YFPR Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeBGA
package instructionVFBGA, BGA4,2X2,16
Contacts4
Reach Compliance Codecompli
ECCN codeEAR99
Factory Lead Time1 week
Samacsys DescriptiSingle Buffer Gate
seriesLVC/LCX/Z
JESD-30 codeS-XBGA-B4
JESD-609 codee1
length0.8 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUFFER
MaximumI(ol)0.032 A
Humidity sensitivity level1
Number of functions1
Number of entries1
Number of terminals4
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeVFBGA
Encapsulate equivalent codeBGA4,2X2,16
Package shapeSQUARE
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packingTR
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Maximum supply current (ICC)0.001 mA
Prop。Delay @ Nom-Su4.1 ns
propagation delay (tpd)9.9 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height0.5 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.4 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width0.8 mm

SN74LVC1G34YFPR Related Products

SN74LVC1G34YFPR SN74LVC1G34DBVTG4 SN74LVC1G34DCKTE4
Description Single Buffer Gate 4-DSBGA -40 to 85 Single Buffer Gate 5-SOT-23 -40 to 125 Buffer 1-CH Non-Inverting CMOS 5-Pin SC-70 T/R
Brand Name Texas Instruments Texas Instruments -
Is it lead-free? Lead free Lead free -
Is it Rohs certified? conform to conform to -
Maker Texas Instruments Texas Instruments -
Parts packaging code BGA SOT-23 -
package instruction VFBGA, BGA4,2X2,16 LSSOP, TSOP5/6,.11,37 -
Contacts 4 5 -
Reach Compliance Code compli compli -
Factory Lead Time 1 week 6 weeks -
series LVC/LCX/Z LVC/LCX/Z -
JESD-30 code S-XBGA-B4 R-PDSO-G5 -
JESD-609 code e1 e4 -
length 0.8 mm 2.9 mm -
Load capacitance (CL) 50 pF 50 pF -
Logic integrated circuit type BUFFER BUFFER -
MaximumI(ol) 0.032 A 0.032 A -
Humidity sensitivity level 1 1 -
Number of functions 1 1 -
Number of entries 1 1 -
Number of terminals 4 5 -
Maximum operating temperature 85 °C 125 °C -
Minimum operating temperature -40 °C -40 °C -
Output characteristics 3-STATE 3-STATE -
Package body material UNSPECIFIED PLASTIC/EPOXY -
encapsulated code VFBGA LSSOP -
Encapsulate equivalent code BGA4,2X2,16 TSOP5/6,.11,37 -
Package shape SQUARE RECTANGULAR -
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH -
method of packing TR TR -
Peak Reflow Temperature (Celsius) 260 260 -
power supply 3.3 V 3.3 V -
Maximum supply current (ICC) 0.001 mA 0.001 mA -
Prop。Delay @ Nom-Su 4.1 ns 4.1 ns -
propagation delay (tpd) 9.9 ns 9.9 ns -
Certification status Not Qualified Not Qualified -
Schmitt trigger NO NO -
Maximum seat height 0.5 mm 1.45 mm -
Maximum supply voltage (Vsup) 5.5 V 5.5 V -
Minimum supply voltage (Vsup) 1.65 V 1.65 V -
Nominal supply voltage (Vsup) 3.3 V 3.3 V -
surface mount YES YES -
technology CMOS CMOS -
Temperature level INDUSTRIAL AUTOMOTIVE -
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Nickel/Palladium/Gold (Ni/Pd/Au) -
Terminal form BALL GULL WING -
Terminal pitch 0.4 mm 0.95 mm -
Terminal location BOTTOM DUAL -
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED -
width 0.8 mm 1.6 mm -
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